KHX16C9T3K2-8X Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – DDR3-1600 CL9 240-Pin DIMM Kit

KHX16C9T3K2/8X
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3-1600 CL9 240-Pin DIMM Kit
SPECIFICATIONS
CL(IDD)
11 cycles
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
48.125ns (min.)
260ns (min.)
Row Active Time (tRASmin)
35ns (min.)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
2.160 W* (per module)
94 V - 0
0^o C to 85^o C
-55^o C to +100^o C
*Power will vary depending on the SDRAM used.
DESCRIPTION
FEATURES
HyperX KHX16C9T3K2/8X is a kit of two 512M x 64-bit (4GB)
DDR3-1600 CL9 SDRAM (Synchronous DRAM) 1Rx8 memory
modules, based on eight 512M x 8-bit DDR3 FBGA components
per module. Each module kit supports Intel^® XMP (Extreme
Memory Profiles). Total kit capacity is 8GB. Each module kit
has been tested to run at DDR3-1600 at a low latency timing of
9-9-9 at 1.65V. The SPDs are programmed to JEDEC standard
latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin
DIMM uses gold contact fingers and requires +1.5V. The
JEDEC standard electrical and mechanical specifications are
as follows:
XMP TIMING PARAMETERS
• JEDEC: DDR3-1600 CL11-11-11 @1.5V
• XMP Profile #1: D3-1600 CL9-9-9 @1.65V
• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 11, 10, 9, 8, 7, 6
• Posted CAS
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB : Height 1.827” (46.41mm) w/ heatsink, single sided
component
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Document No. 4806586-001.C00 03/19/14 Page 1