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HX430C16PBK2-32 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – DDR4-288- DDR4 3000 CL16 288 Pin DIMM | |||
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Memory Module Specifications
HX430C16PBK2/32
32GB (16GB 2G x 64-Bit x 2 pcs.)
DDR4-3000 CL16 288-Pin DIMM
DESCRIPTION
HyperX HX430C16PBK2/32 is a kit of two 2G x 64-bit (16GB)
DDR4-3000 CL16 SDRAM (Synchronous DRAM) 2Rx8,
memory module, based on sixteen 1G x 8-bit FBGA
components per module. Each module kit supports Intel®
Extreme Memory Profiles (Intel® XMP) 2.0. Total kit
capacity is 32GB. Each module has been tested to run at
DDR4-3000 at a low latency timing of 16-16-16 at 1.35V. The
SPDs are programmed to JEDEC standard latency
DDR4-2133 timing of 15-15-15 at 1.2V. Each 288-pin
DIMM uses gold contact fingers. The JEDEC standard
electrical and mechanical specifications are as follows:
XMP TIMING PARAMETERS
â¢JEDEC: DDR4-2133 CL15-15-15 @1.2V
â¢XMP Profile #1: DDR4-3000 CL16-16-16 @1.35V
â¢XMP Profile #2: DDR4-2666 CL15-15-15 @1.35V
SPECIFICATIONS
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
15 cycles
46.5ns(min.)
350ns(min.)
33ns(min.)
TBD W*
94 V - 0
0o C to +85o C
-55o C to +100o C
*Power will vary depending on the SDRAM used.
FEATURES
⢠Power Supply: VDD = 1.2V Typical
⢠VDDQ = 1.2V Typical
⢠VPP - 2.5V Typical
⢠VDDSPD = 2.25V to 3.6V
⢠On-Die termination (ODT)
⢠16 internal banks; 4 groups of 4 banks each
⢠Bi-Directional Differential Data Strobe
⢠8 bit pre-fetch
⢠Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
⢠Height 2.167â (55.05mm)
hyperxgaming.com
Continued >>
Document No. 4807467-001.A00 10/30/15 Page 1
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