HX426C13SBK4-16 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – DDR4-2666 CL13 288-Pin DIMM Kit

Memory Module Specifications
HX426C13SBK4/16
16GB (4GB 512M x 64-Bit x 4 pcs.)
DDR4-2666 CL13 288-Pin DIMM Kit
DESCRIPTION
HyperX HX426C13SBK4/16 is a kit of four 512M x 64-bit (4GB)
DDR4-2666 CL13 SDRAM (Synchronous DRAM) 1Rx8, memory
modules, based on eight 512M x 8-bit FBGA components per
module. Total kit capacity is 16GB. Each module supports
Intel® XMP (Extreme Memory Profiles). Each module has
been tested to run at DDR4-2666 at a low latency timing of
13-14-14 at 1.35V. The SPDs are programmed to JEDEC
standard latency DDR4-2133 timing of 15-15-15 at 1.2V.
Each 288-pin DIMM uses gold contact fingers. The JEDEC
standard electrical and mechanical specifications are as
follows:
XMP TIMING PARAMETERS
•JEDEC: DDR4-2133 CL15-15-15 @1.2V
•XMP Profile #1: DDR4-2666 CL13-14-14 @1.35V
•XMP Profile #2: DDR4-2400 CL13-13-13 @1.35V
SPECIFICATIONS
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
15 cycles
46.5ns (min.)
260ns (min.)
33ns (min.)
TBD W*
94 V - 0
0^o C to +85^o C
-55^o C to +100^o C
*Power will vary depending on the SDRAM used.
FEATURES
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD = 2.25V to 3.6V
• On-Die termination (ODT)
• 16 internal banks; 4 groups of 4 banks each
• Bi-Directional Differential Data Strobe
• 8 bit pre-fetch
• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
• Height 1.36” (34.57mm)
hyperxgaming.com
Continued >>
Document No. 4807413-001.A00 08/27/15 Page 1