HF-625 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Reinforced Phase Change Thermal Interface Material

Hi-Flow^® 625
July 2011
PRODUCT DESCRIPTION
Reinforced Phase Change
Thermal Interface Material
FEATURES AND BENEFITS
• Thermal impedance: 0.71°C-in²/W
(@25 psi)
• Electrically isolating
• 6 5°C phase change compound coated
on PEN film
• Tack-free and scratch-resistant
Hi-Flow^® 625 is a film-reinforced phase
change material. The product consists of
a thermally conductive 65°C phase change
compound coated on PEN film.
Hi-Flow^® 625 is designed to be used as a
thermal interface material between
electronic power devices that require
electrical isolation and a heat sink. The
reinforcement makes Hi-Flow^® 625
easy to handle, and the 65°C phase
change temperature of the coating material
eliminates shipping and handling problems.
The PEN film has a continuous use
temperature of 150°C.
Hi-Flow^® 625 is tack-free and scratch-
resistant at production temperature and
does not require a protective liner in most
shipping situations. The material has the
thermal performance of 2-3 mil mica and
grease assemblies.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF HI-FLOW 625
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Green
Green
Visual
Reinforcement Carrier
PEN Film
PEN Film
—
Thickness (inch) / (mm)
0.005
0.127
ASTM D374
Elongation (%45° to Warp and Fill)
60
60
ASTM D882A
Tensile Strength (psi) / (MPa)
30,000
206
ASTM D882A
Continuous Use Temp (°F) / (°C)
302
150
—
Phase Change Temp (°F) / (°C)
149
65
ASTM D3418
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
4000
4000
ASTM D149
Dielectric Constant (1000 Hz)
3.5
Volume Resistivity (Ohm-meter)
10¹⁰
3.5
ASTM D150
10¹⁰
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)
0.5
0.5
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10
25
50
100
200
TO-220 Thermal Performance (°C/W) 2.26 2.10 2.00 1.93 1.87
Thermal Impedance (°C-in²/W) (2) 0.79
0.71
0.70
0.67
0.61
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate. The
Hi-Flow coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test. The recorded value includes
interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Spring / clip mounted
• Power semiconductors
• Power modules
CONFIGURATIONS AVAILABLE
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
PDS_HF_625_0711