HF-565UT Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Tacky, High Performance, Un-Reinforced Phase Change TIM

Hi-Flow^® 565UT
July 2011
PRODUCT DESCRIPTION
Tacky, High Performance,
Un-Reinforced Phase Change TIM
FEATURES AND BENEFITS
• Thermal impedance: 0.05°C-in²/W
(@25 psi)
• High thermal conductivity: 3.0 W/mk
• Phase change softening temp 52°C
• Naturally tacky
• Tabulated for ease of assembly
Hi-Flow^® 565UT is a naturally tacky,
thermally conductive phase change
material which is supplied in an easy to
use tabulated pad form. In the application
the material undergoes a phase change
softening, starting near 52°C. The phase
change softening feature improves handling
characteristics prior to a facilitated
assembly. At application temperatures and
pressures, Hi-Flow^® 565UT wets out the
thermal interfaces producing a very low
thermal impedance.
The thermal performance of Hi-Flow^® 565UT
is comparable to the best thermal greases.
Hi-Flow^® 565UT is provided at a consistent
thickness to ensure reliable performance.
Hi-Flow^® 565UT can be applied in high
volumes to the target surface via low
pressure from a roller or manual application.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF HI-FLOW 565UT
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Blue
Blue
Visual
Reinforcement Carrier
None
None
—
Thickness (inch) / (mm)
0.005, 0.010
0.127, 0.254
ASTM D374
Continuous Use Temp (°F) / (°C)
257
125
—
Phase Change Softening Temp (°F) / (°C)
126
52
ASTM D3418
ELECTRICAL
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)
3.0
3.0
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10
25
50
100
200
TO-220 Thermal Performance (°C/W) 0.37 0.35 0.34 0.30 0.26
Thermal Impedance (°C-in²/W)(2) 0.09
0.05
0.03
0.02
0.02
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.
The Hi-Flow coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall
conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.
This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications
are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test. The recorded value includes
interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the sur-
face roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Processor lid to heat sink
• FBDIMM to heat spreader
• Processor die to lid or heat sink
CONFIGURATIONS AVAILABLE
• Tabulated in roll form, kiss-cut parts – no holes
• Hi-Flow^® 565UT is limited to a square or rectangular part design.
Dimensional tolerance is +/- 0.020 inch (0.5mm)
PDS_HF_565UT_0711