HF-300P Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Electrically Insulating,Thermally Conductive Phase Change Material

Hi-Flow^® 300P
November 2013
PRODUCT DESCRIPTION
Electrically Insulating,Thermally Conductive
Phase Change Material
FEATURES AND BENEFITS
• Thermal impedance: 0.13°C-in2/W
(@25 psi)
• Field-proven polyimide film
- excellent dielectric performance
- excellent cut-through resistance
• Outstanding thermal performance in
an insulated pad
Hi-Flow^® 300P consists of a thermally
conductive 55°C phase change compound
coated on a thermally conductive polyimide
film.The polyimide reinforcement makes
the material easy to handle and the 55°C
phase change temperature minimizes
shipping and handling problems.
Hi-Flow^® 300P achieves superior values in
voltage breakdown and thermal performance
when compared to its competition.The
product is supplied on an easy release liner
for exceptional handling in high volume
manual assemblies. Hi-Flow 300P is
designed for use as a thermal interface
material between electronic power devices
requiring electrical isolation to the heat sink.
Bergquist suggests the use of spring clips to
assure constant pressure with the interface
and power source. Please refer to thermal
performance data to determine nominal
spring pressure for your application.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF HI-FLOW 300P
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Green
Green
Visual
Reinforcement Carrier
Polyimide
Polyimide
—
Thickness (inch) / (mm)
0.004 - 0.005
0.102 - 0.127
ASTM D374
Film Thickness (inch) / (mm)
0.001 - 0.002
0.025 - 0.050
ASTM D374
Elongation (%)
40
40
ASTM D882A
Tensile Strength (psi) / (MPa)
7000
48
ASTM D882A
Continuous Use Temp (°F) / (°C)
302
150
—
Phase Change Temp (°F) / (°C)
131
55
ASTM D3418
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
5000
5000
ASTM D149
Dielectric Constant (1000 Hz)
4.5
Volume Resistivity (Ohm-meter)
10¹²
4.5
ASTM D150
10¹²
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)
1.6
1.6
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10
25
50
100
200
TO-220 Thermal Performance (°C/W) 0.0010" 0.95 0.94 0.92 0.91 0.90
TO-220 Thermal Performance (°C/W) 0.0015" 1.19 1.17 1.16 1.14 1.12
TO-220 Thermal Performance (°C/W) 0.0020" 1.38 1.37 1.35 1.33 1.32
Thermal Impedance (°C-in²/W) 0.0010" (2) 0.13
0.13
0.12
0.12
0.12
Thermal Impedance (°C-in²/W) 0.0015" (2) 0.17
0.16
0.16
0.16
0.15
Thermal Impedance (°C-in²/W) 0.0020" (2) 0.19
0.19
0.19
0.18
0.18
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test. The recorded value includes
interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Spring / clip mounted
• Discrete power semiconductors and modules
CONFIGURATIONS AVAILABLE
• Roll form, die-cut parts and sheet form, dry both sides
We produce thousands of specials. Tooling charges vary
depending on tolerances and complexity of the part.
PDS_HF_300P_1113