HF-300G Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Fiberglass-Reinforced, Phase Change Thermal Interface Material

Hi-Flow^® 300G
September 2008
PRODUCT DESCRIPTION
Fiberglass-Reinforced, Phase
Change Thermal Interface Material
FEATURES AND BENEFITS
• Thermal impedance: 0.20°C-in²/W
(@25 psi)
• Will not drip or run like grease
• P hase change compound coated on a
fiberglass carrier
Hi-Flow^® 300G consists of a thermally
conductive 55°C phase change compound
coated on a fiberglass web. Hi-Flow^® 300G
is designed as a thermal interface material
between a computer processor and a
heat sink.
Above the phase change temperature,
Hi-Flow^® 300G wets-out the thermal interface
surfaces and flows to produce low thermal
impedance.The material requires pressure of
the assembly to cause flow. Hi-Flow^® 300G
will not drip or run like grease.
TYPICAL APPLICATIONS INCLUDE
• Computer and peripherals
• As a thermal interface where bare die is
exposed and needs to be heat sinked
CONFIGURATIONS AVAILABLE
• Sheet form, die-cut parts and
roll form
• With or without pressure
sensitive adhesive.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF HI-FLOW 300G
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Green
Green
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.005
0.127
ASTM D374
Elongation (%45° to Warp and Fill)
40
40
ASTM D882A
Tensile Strength (psi) / (MPa)
400
3
ASTM D882A
Continuous Use Temp (°F) / (°C)
212
100
—
Phase Change Temp (°F) / (°C)
131
55
ASTM 3418
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
300
300
ASTM D149
Dielectric Constant (1000 Hz)
3.5
Volume Resistivity (Ohm-meter)
10⁸
3.5
ASTM D150
10⁸
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)
1.6
1.6
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10
25
50
100
200
TO-220 Thermal Performance (°C/W) 0.96 0.92 0.88 0.85 0.84
Thermal Impedance (°C-in²/W) (2) 0.27
0.20
0.16
0.15
0.14
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test. The recorded value includes
interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
Application Methods:
1. Hand-apply to 40°- 50°C heat sink.The heat sink is heated in an oven or by a heat
gun to between 40°- 50°C allowing the Hi-Flow^® 300G pad to be applied like an
adhesive pad.The heat sink is then cooled to room temperature and packaged.
2. Hand-apply to 20°- 35°C heat sink. Hi-Flow^® 300G can be applied to a room
temperature heat sink with the assistance of a foam roller.The pad is positioned on
the heat sink and a hand roller is used to apply pressure of 30 psi.
3. Automated equipment with 30 psi pressure. A pick-and-place automated dispensing
unit can be used to apply Hi-Flow^® 300G to a room temperature heat sink.The
placement head should have a soft silicone rubber pad, and apply 30 psi pressure
to the pad on transfer to the 20°- 35°C heat sink.
PDS_HF_300G_September 2008