HF-225UT Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Un-Reinforced, Pressure Sensitive Phase Change Thermal Interface Material

Hi-Flow^® 225UT
August 2013
PRODUCT DESCRIPTION
Un-Reinforced, Pressure Sensitive Phase
Change Thermal Interface Material
FEATURES AND BENEFITS
• Thermal impedance: 0.08°C-in²/W
(@25 psi)
• 5 5°C phase change composite with
inherent tack characteristics
• High-visibility protective tabs
• P ressure sensitive phase change
thermal interface material
Hi-Flow^® 225UT is designed as a pressure
sensitive thermal interface material for use
between a high performance processor and
a heat sink. Hi-Flow^® 225UT is a thermally
conductive 55°C phase change composite
with inherent tack. The material is supplied
on a polyester carrier liner and is available
with high-visibility protective tabs.
Above its phase change temperature,
Hi-Flow^® 225UT wets-out the thermal
interface surfaces and flows to produce
the lowest thermal impedance. The
material requires pressure of the assembly
to cause flow. Hi-Flow^® 225UT coatings
will resist dripping.
Application Methods
1. Hand-apply Hi-Flow^® 225UT to a
room- temperature heat sink. The
Hi-Flow^® 225UT pad exhibits inherent
tack and can be hand-applied similar
to an adhesive pad. The tab liner can
remain on the heat sink and pad
throughout shipping and handling until
is it is ready for final assembly.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF HI-FLOW 225UT
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Black
Black
Visual
Reinforcement Carrier
None
None
—
Thickness (inch) / (mm)
0.003
0.077
ASTM D374
Continuous Use Temp (°F) / (°C)
248
120
—
Phase Change Temp (°F) / (°C)
131
55
ASTM D3418
ELECTRICAL
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)
0.7
0.7
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10
25
50
100
200
TO-220 Thermal Performance (°C/W) 0.60 0.53 0.46 0.40 0.35
Thermal Impedance (°C-in²/W) (2) 0.09
0.08
0.07
0.06
0.05
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate. The
Hi-Flow coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivi-
ty of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic
is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test. The recorded value includes
interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Computer and peripherals
• High performance computer processors
• Graphic cards
• Power modules
CONFIGURATIONS AVAILABLE
• Roll form with tabs, kiss-cut parts – no holes
Hi-Flow^® 225UT is limited to a square or rectangular part design.
Dimensional tolerance is +/- 0.020 inch (0.5mm).
HF 225UT
Roll Form,
Kiss-Cut Parts
Clear/Colored
Protective Tab
"Quick-Snap" High Visibility
Tab for Removal
Clear Polyester
Carrier Liner
Adhesive Strip
PDS_HF_225UT_0813