HF-225U Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Non-Reinforced Phase Change Thermal Interface Material

Hi-Flow^® 225U
September 2008
PRODUCT DESCRIPTION
Non-Reinforced Phase Change
Thermal Interface Material
FEATURES AND BENEFITS
• Thermal impedance: 0.07°C-in²/W
(@25 psi)
• Hi-Flow^® coating will resist dripping
• Thermally conductive 55°C phase
change compound
• Available in roll form with kiss-cut parts
Hi-Flow^® 225U is designed for use as a
thermal interface material between a
computer processor and a heat sink.The
product consists of a thermally conductive
55°C phase change compound coated on a
release liner and supplied on a carrier.
Above its phase change temperature,
Hi-Flow^® 225U wets-out the thermal interface
surfaces and flows to produce low thermal
impedance. Hi-Flow^® 225U requires pressure
of the assembly to cause flow.
TYPICAL APPLICATIONS INCLUDE
• Computer and peripherals
• High performance computer processors
• Graphic cards
• Power modules
CONFIGURATIONS AVAILABLE
• Roll form with tabs and kiss-cut parts –
no holes
Hi-Flow^® 225U is limited to a square or
rectangular part design. Dimensional
tolerance is +/- 0.020 inch (0.5mm).
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF HI-FLOW 225U
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Black
Black
Visual
Reinforcement Carrier
None
None
—
Thickness (inch) / (mm)
0.0015
0.036
ASTM D374
Continuous Use Temp (°F) / (°C)
302
150
—
Phase Change Temp (°F) / (°C)
131
55
ASTM D3418
ELECTRICAL
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)
1.0
1.0
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10
25
50
100
200
TO-220 Thermal Performance (°C/W) 0.53 0.47 0.39 0.34 0.32
Thermal Impedance (°C-in²/W) (2) 0.08
0.07
0.06
0.05
0.04
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test. The recorded value includes
interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
Application Method:
1. Hand-apply to 35°- 45°C heat sink.The heat sink is heated in an oven or via
heat gun to between 35°- 45°C.The Hi-Flow^® 225U part is then applied like an
adhesive pad.The heat sink is cooled to room temperature and packaged.
A protective tab liner remains in place until the unit is ready for final assembly.
The protective tab can be readily removed from the applied Hi-Flow^® 225U pad
at a maximum temperature of 28°C.
2. Automated equipment with 30-psi pressure. A pick-and-place automated
dispensing unit can be used to apply the Hi-Flow^® 225U pad to a room-temperature
heat sink.The placement head should have a silicone rubber pad, and should
apply approximately 30 psi pressure to the pad on transfer to the 25° – 35°C
heat sink. Once applied, the protective tab can be readily removed from the
Hi-Flow^® 225U pad at a maximum temperature of 28°C.
PDS_HF_225U_September 2008