HF-225F Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Soft, thermally conductive 55°C phase change compound

Hi-Flow^® 225F-AC
December 2008
PRODUCT DESCRIPTION
Reinforced, Phase Change
Thermal Interface Material
FEATURES AND BENEFITS
• Thermal impedance: 0.10°C-in²/W
(@25 psi)
• C an be manually or automatically
applied to the surfaces of room-
temperature heat sinks
• Foil reinforced, adhesive-coated
• S oft, thermally conductive 55°C phase
change compound
Hi-Flow^® 225F-AC is a high performance,
thermal interface material for use between a
computer processor and a heat sink.
Hi-Flow^® 225F-AC consists of a soft, thermally
conductive 55°C phase change compound
coated to the top surface of an aluminum
carrier with a soft, thermally conductive
adhesive compound coated to the bottom
surface to improve adhesion to the heat sink.
Above the 55°C phase change
temperature, Hi-Flow^® 225F-AC wets-out
the thermal interface surfaces and flows to
produce low thermal impedance.
Hi-Flow^® 225F-AC requires pressure
from the assembly to cause material flow.
The Hi-Flow^® coatings resist dripping in
vertical orientation.
The material includes a base carrier liner
with differential release properties to facilitate
simplicity in roll form packaging and
application assembly. Please contact
Bergquist Product Management for
applications that are less than 0.07'' square.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF HI-FLOW 225F-AC
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Black
Black
Visual
Reinforcement Carrier
Aluminum
Aluminum
—
Thickness (inch) / (mm)
0.004
0.102
ASTM D374
Carrier Thickness (inch) / (mm)
0.0015
0.038
ASTM D374
Continuous Use Temp (°F) / (°C)
248
120
—
Phase Change Temp (°F) / (°C)
131
55
ASTM D3418
ELECTRICAL
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)
1.0
1.0
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10
25
50
100
200
TO-220 Thermal Performance (°C/W) 0.87 0.68 0.57 0.50 0.45
Thermal Impedance (°C-in²/W) (2) 0.12
0.10
0.09
0.08
0.07
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate. The
Hi-Flow coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivi-
ty of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic
is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test. The recorded value includes
interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Computer and peripherals
• Power conversion
• High performance computer processors
• Power semiconductors
• Power modules
CONFIGURATIONS AVAILABLE
• Roll form, kiss-cut parts, and sheet form
PDS_HF_225F AC_1208