HF-105 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Phase Change Coated Aluminum

Hi-Flow^® 105
December 2008
PRODUCT DESCRIPTION
Phase Change Coated Aluminum
FEATURES AND BENEFITS
• Thermal impedance: 0.37°C-in²/W
(@25 psi)
• U sed where electrical isolation is
not required
• Low volatility – less than 1%
• E asy to handle in the
manufacturing environment
• Flows but doesn’t run like grease
Hi-Flow^® 105 is a phase change material
coated on both sides of an aluminum
substrate. It is designed specifically to
replace grease as a thermal interface,
eliminating the mess, contamination and
difficult handling associated with grease.
Hi-Flow^® 105 is tack-free and scratch
resistant at room temperature and does
not require a protective liner in shipment
when attached to a heat sink.
At 65°C (phase change temperature),
Hi-Flow^® 105 changes from a solid and
flows, thereby assuring total wet-out of the
interface. The thixotropic characteristics of
Hi-Flow^® 105 reduce the pump-out from
the interface.
Hi-Flow^® 105 has thermal performance
equal to grease with 0.10°C-in²/W contact
thermal resistance.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF HI-FLOW 105
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Dark Gray
Dark Gray
Visual
Reinforcement Carrier
Aluminum
Aluminum
—
Thickness (inch) / (mm)
0.0055
0.139
ASTM D374
Continuous Use Temp (°F) / (°C)
266
130
—
Phase Change Temp (°F) / (°C)
149
65
ASTM D3418
ELECTRICAL
Dielectric Constant (1000 (Hz)
3.2
3.2
ASTM D150
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)
0.9
0.9
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10
25
50
100
200
TO-220 Thermal Performance (°C/W) 0.95 0.80 0.74 0.69 0.64
Thermal Impedance (°C-in²/W) (2) 0.39
0.37
0.36
0.33
0.30
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate. The
Hi-Flow coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivi-
ty of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic
is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test. The recorded value includes
interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Power semiconductors
• Microprocessors mounted on a heat sink
• Power conversion modules
• Spring or clip mount applications where thermal grease is used
CONFIGURATIONS AVAILABLE
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
PDS_HF_105_1208