H48-6C Datasheet, PDF (1/1 Pages) List of Unclassifed Manufacturers – Thermal Conductive Pad

H48-6C
Thermal Conductive Pad
Features
Very good thermal conductivity
Very soft and compressible
Natural tack
Easy to assemble
Very good insulator
Applications
Electronic components: IC / CPU / MOS
LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /
Wireless Hub etc....
DDR II Module / DVD Applications / Hand-Set applications etc...
Thermal Resistance V.S Pressure V.S Deflection
Properties
Thermal Conductivity: 3.2 W/mK
(W/mK - Z Axis)
REACH Compliant
RoSH Compliant
Hardness: 15 (Shore A)
(Shore A)
In the thermal resistance vs pressure vs deflection charts H48-6C provides low thermal impedance.
As the pressure increases the thermal impedance decreases. H48-6C provides good compliance and softness.
Property
Colour
Thickness
(Available thickness range)
Thermal Conductivity
Flammability Rating
Dielectric Breakdown Voltage
Weight Loss
Specific Gravity
Working Temperature
Volume Resistance
Elongation
Tensile Strength
Standard Shape
Hardness
H48-6C
Dark grey
0.3 - 20
0.0118 - 0.787
3.2
V-0
›5
‹1
2.42
-40 to 200
›10¹¹
130
8
-
15
Unit
-
mm
inch
W/mK
-
kV/mm
%
g/cm³
˚C
Ohm-cm
%
Kgf/cm²
Sheets 320-320mm
Shore A
Tolerance
-
-
-
-
-
-
-
±0.2
-
-
±13
±2
-
±5
Test Method
Visual
ASTM D374
ASTM D374
ASTM D5470
UL 94
ASTM D149
ASTM E595
ASTM D792
-
ASTM D257
ASTM D412
ASTM D412
-
ASTM D2240
Available with an adhesive backing
1. Part Number
2. Size X-Y-Z
3. Adhesive backing – 0-None, 1A-one side, 2A-two sides
4. Quantity
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