H48-2K Datasheet, PDF (1/1 Pages) List of Unclassifed Manufacturers – Thermal Conductive Pad on rolls

H48-2K
Thermal Conductive Pad on rolls
Features
No carrier
Low contact thermal impedance
Non-Oil Blead
High dielectric breakdown voltage
Applications
Electronic components: IC / CPU / MOS
LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /
Wireless Hub etc....
DDR II Module / DVD Applications / Hand-Set applications etc...
Properties
Thermal Conductivity: 1.8 W/m.k
(W / m.k - Z Axis)
REACH Compliant
RoHS Compliant
Hardeness: 60 (Shore A)
(Shore A)
In the thermal resistance vs pressure vs deflection charts H48-2K provides low thermal impedance.
As the pressure increases the thermal impedance decreases. H48-2K provides good compliance and softness.
Property
Thickness
Color
Construction
Opt.Temp. Range
Density
Thermal Conductivity
Hardness Shore A
Thermal impedance
10psi
50psi
100psi
Percent deflection
10psi
50psi
100psi
Breakdown voltage
TML
Tensile strength
Elongation
UL flammability
Roll Length / Width
H48-2K
0.1/ 0.15 / 0.2 / 0.3
Dark Red
Silicone based with ceramic fillers
(non-silicone oil)
-45 to 200
2.1
1.8
60
0.21/0.37/0.57
0.20/0.33/0.51
0.17/0.31/0.46
2
5
11
1.2 / 2.5 / 3.5
‹ 0.5%
200
50
V-0
50 - 320
Unit
mm
-
-
˚C
g/cm³
W/m.k
-
K- in²/W
K- in²/W
K- in²/W
%
%
%
kV
%
Psi
%
-
Metres / mm
Test Method
-
Visual
-
-
ASTM D792
ASTM D5470
ASTM D2240
ASTM D5470
-
-
-
ASTM D575
-
-
-
ASTM D149
ASTM E595
ASTM D412
ASTM D412
UL 94
-
Available with an adhesive backing
1. Part Number
2. Size X-Y-Z
3. Adhesive backing – 0-None, 1A-one side, 2A-two sides
4. Quantity
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