GP-VOULTRASOFT-B Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Thermal conductivity: 1.0 W/m-K

Gap Pad^® VO Ultra Soft-B
June 2013
PRODUCT DESCRIPTION
Ultra Conformable,Thermally Conductive
Material for Filling Air Gaps
FEATURES AND BENEFITS
• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• Gel-like modulus
• Decreased strain
• Puncture, shear and tear resistant
• Electrically isolating
Gap Pad^® VO Ultra Soft-B is recommended
for applications that require a minimum
amount of pressure on components.The
viscoelastic nature of the material also gives
excellent low-stress vibration dampening
and shock absorbing characteristics.
Gap Pad^® VO Ultra Soft-B is an electrically
isolating material, which allows its use in
applications requiring isolation between heat
sinks and high-voltage, bare-leaded devices.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT-B
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Black/Black
Black/Black
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
Inherent Surface Tack (1 sided)
1
1
—
Density (Bulk Rubber) (g/cc)
1.6
1.6
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1)
5
5
ASTM D2240
Young's Modulus (psi) / (kPa) (2)
8
55
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
6000
6000
ASTM D149
Dielectric Constant (1 Mhz)
5.5
5.5
ASTM D150
Volume Resistivity (Ohm-meter)
10¹¹
10¹¹
ASTM D257
Flame Rating
V-0
V-0
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
1.0
1.0
ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain)
10
20
30
Thermal Impedance (°C-in²/W) 0.040" (3) 1.97
1.87
1.68
Thermal Impedance (°C-cm²/W) 1.016mm (3) 12.7
12.1
10.8
1) Thir ty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain
with a sample size of 0.79 inch². 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the sur-
face roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Various IC packages
• Telecommunications
• Between any heat-generating semiconductor and a heat sink
• Automotive
• LED lighting packages
• Computers and peripherals
CONFIGURATIONS AVAILABLE
• Sheet form and die-cut parts
Thickness vs. Thermal Resistance
Gap Pad VO Ultra Soft-B
150
100
50
0
1
2
3
4
5
6
Thermal Resistance (C-in²/W)
PDS_GP_VOUS B_June 2013