GP-VOSOFT Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Thermal conductivity: 0.8 W/m-K

Gap Pad^® VO Soft
July 2011
PRODUCT DESCRIPTION
Highly Conformable,Thermally Conductive
Material for Filling Air Gaps
FEATURES AND BENEFITS
• Thermal conductivity: 0.8 W/m-K
• Conformable, low hardness
• Enhanced puncture, shear and
tear resistance
• Electrically isolating
Gap Pad^® VO Soft is recommended for
applications that require a minimum
amount of pressure on components.
Gap Pad^® VO Soft is a highly conformable,
low-modulus, filled-silicone polymer on a
rubber-coated fiberglass carrier.The
material can be used as an interface
where one side is in contact with a
leaded device.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP PAD VO SOFT
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Mauve/Pink
Mauve/Pink
Visual
Reinforcement Carrier
Sil-Pad
Sil-Pad
—
Thickness (inch) / (mm)
0.020 to 0.200
0.508 to 5.080
ASTM D374
Inherent Surface Tack (1 side)
1
1
—
Density (Bulk Rubber) (g/cc)
1.6
1.6
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1)
25
25
ASTM D2240
Young's Modulus (psi) / (kPa) (2)
40
275
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>6000
>6000
ASTM D149
Dielectric Constant (1000 Hz)
5.5
5.5
ASTM D150
Volume Resistivity (Ohm-meter)
10¹¹
10¹¹
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
0.8
0.8
ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain)
10
20
30
Thermal Impedance (°C-in²/W) 0.040" (3) 2.48
2.29
2.11
1) Thir ty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain
with a sample size of 0.79 inch². 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Telecommunications
• Computer and peripherals
• Power conversion
• Between heat-generating semiconductors or
magnetic components and a heat sink
• Area where heat needs to be transferred to a frame,
chassis, or other type of heat spreader
CONFIGURATIONS AVAILABLE
• Sheet form and die-cut parts
200
180
160
140
120
100
80
60
40
20
1
Thickness vs. Thermal Resistance
Gap Pad VO Soft
2 3 4 5 6 7 8 9 10
Thermal Resistance (C-in²/W)
PDS_GP_VOS_0711