GP-VO Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Thermal conductivity: 0.8 W/m-K

Gap Pad^® VO
July 2011
PRODUCT DESCRIPTION
Conformable,Thermally Conductive
Material for Filling Air Gaps
FEATURES AND BENEFITS
• Thermal conductivity: 0.8 W/m-K
• Enhanced puncture, shear and
tear resistance
• Conformable gap filling material
• Electrically isolating
Gap Pad^® VO is a cost-effective, thermally
conductive interface material.The material
is a filled, thermally conductive polymer
supplied on a rubber-coated fiberglass
carrier allowing for easy material
handling.The conformable nature of
Gap Pad^® VO allows the pad to fill in air
gaps between PC boards and heat sinks
or a metal chassis.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP PAD VO
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Gold/Pink
Gold/Pink
Visual
Reinforcement Carrier
Sil-Pad
Sil-Pad
—
Thickness (inch) / (mm)
0.020 to 0.250
0.508 to 6.350
ASTM D374
Inherent Surface Tack (1 sided)
1
1
—
Density (Bulk Rubber) (g/cc)
1.6
1.6
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1)
40
40
ASTM D2240
Young's Modulus (psi) / (kPa) (2)
100
689
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>6000
>6000
ASTM D149
Dielectric Constant (1000 Hz)
5.5
5.5
ASTM D150
Volume Resistivity (Ohm-meter)
10¹¹
10¹¹
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
0.8
0.8
ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain)
10
20
30
Thermal Impedance (°C-in²/W) 0.040" (3) 2.47
2.37
2.24
1) Thir ty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain
with a sample size of 0.79 inch². 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the sur-
face roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Telecommunications
• Computer and peripherals
• Power conversion
• Between heat-generating semiconductors or
magnetic components and a heat sink
• Area where heat needs to be transferred to a frame,
chassis, or other type of heat spreader
CONFIGURATIONS AVAILABLE
• Sheet form and die-cut parts
250
200
150
100
50
0
1
Thickness vs. Thermal Resistance
Gap Pad VO
3 5 7 9 11 13
Thermal Resistance (C-in²/W)
PDS_GP_VO_0711