GP-HC3.0 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Thermal Conductivity: 3.0 W/m-K

Gap Pad^® HC 3.0
April 2015
PRODUCT DESCRIPTION
High-Compliance, Thermally Conductive,
Low Modulus Material
FEATURES AND BENEFITS
• Thermal Conductivity: 3.0 W/m-K
• High-compliance, low compression stress
• F iberglass reinforced for shear and
tear resistance
Gap Pad^® HC 3.0 is a soft and compliant
gap filling material with a thermal
conductivity of 3.0 W/m-K. The material
offers exceptional thermal performance at
low pressures due to a unique 3.0 W/m-K
filler package and low-modulus resin
formulation. The enhanced material is
ideal for applications requiring low stress
on components and boards during
assembly. Gap Pad^® HC 3.0 maintains a
conformable nature that allows for quick
recovery and excellent wet-out
characteristics, even to surfaces with high
roughness and/or topography.
Gap Pad^® HC 3.0 is offered with natural
inherent tack on both sides of the material,
eliminating the need for thermally-
impeding adhesive layers. The top side
has minimal tack for ease of handling.
Gap Pad^® HC 3.0 is supplied with
protective liners on both sides.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP PAD HC 3.0
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Blue
Blue
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
Inherent Surface Tack
2
2
—
Density (Bulk Rubber) (g/cc)
3.1
3.1
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (4)
15
15
ASTM D2240
Young's Modulus (psi) / (kPa) (1)
16
110
ASTM D575
Typical Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac) (3)
5000
5000
ASTM D149
Dielectric Constant (1000 Hz)
6.5
6.5
ASTM D150
Volume Resistivity (Ohm-meter)
10¹⁰
10¹⁰
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (2)
3.0
3.0
ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain)
10
20
30
Thermal Impedance (°C-in²/W) 0.040" (2)
0.57
0.49
0.44
1) Young’s Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch² after 5 minutes of
compression at 10% strain on a 1mm thickness material.
2) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are
provided for reference only. Actual application performance is directly related to the surface roughness, flatness and
pressure applied.
3) Minimum value at 20 mil.
4) Thirty second delay value on Shore 00 hardness scale.
TYPICAL APPLICATIONS INCLUDE
• Telecommunications
• ASICs and DSPs
• Consumer electronics
• Thermal modules to heat sinks
CONFIGURATIONS AVAILABLE
• Sheet form and die-cut parts
140
120
100
80
60
40
20
0
.25
Thickness vs. Thermal Resistance
Gap Pad HC 3.0
.50 .75 1.00 1.25 1.50 1.75 2.00
Thermal Resistance (C-in²/W)
PDS_GP_HC 3_0415