GP-HC1000 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Thermal conductivity: 1.0 W/m-K

Gap Pad^® HC1000
PRODUCT DESCRIPTION
“Gel-Like” Modulus Gap Filling Material
FEATURES AND BENEFITS
• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-like” modulus
• Fiberglass reinforced for puncture,
shear and tear resistance
Gap Pad^® HC 1000 is an extremely
conformable, low-modulus polymer that
acts as a thermal interface and electrical
insulator between electronic components
and heat sinks.The “gel-like” modulus
allows this material to fill air gaps to
enhance the thermal performance of
electronic systems. Gap Pad^® HC1000 is
offered with removable protective liners
on both sides of the material.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
Thickness vs. Thermal Resistance
Gap Pad HC1000
20
18
16
14
12
10
0.25 0.30 0.35 0.40 0.45 0.50 0.55
Thermal Resistance (C-in²/W)
July 2011
TYPICAL PROPERTIES OF GAP PAD HC1000
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Gray
Gray
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.010 to 0.020
0.254 to 0.508
ASTM D374
Inherent Surface Tack (1 side)
2
2
—
Density (Bulk Rubber) (g/cc)
1.6
1.6
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1)
25
25
ASTM D2240
Young's Modulus (psi) / (kPa) (2)
40
275
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>5000
>5000
ASTM D149
Dielectric Constant (1000 Hz)
5.5
5.5
ASTM D150
Volume Resistivity (Ohm-meter)
10¹¹
10¹¹
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
1.0
1.0
ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain)
10
20
30
Thermal Impedance (°C-in²/W) 0.020" (3) 1.30
1.00
0.96
1) Thir ty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain
with a sample size of 0.79 inch². 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Computer and peripherals
• Telecommunications
• Heat interfaces to frames, chassis or other heat spreading devices
• RDRAM™ memory modules/chip scale packages
• CDROM/DVD cooling
• Areas where irregular surfaces need to make a thermal interface to a heat sink
• DDR SDRAM memory modules
• FBDIMM modules
CONFIGURATIONS AVAILABLE
• Sheet form, die-cut parts, and roll form (converted or unconverted)
PDS_GP_HC1000_0711