GP-EMI1.0 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Thermal Conductivity: 1.0 W/m-K

Gap Pad^® EMI 1.0
May 2015
PRODUCT DESCRIPTION
Thermally Conductive, Conformable
EMI Absorbing Material
FEATURES AND BENEFITS
• Thermal Conductivity: 1.0 W/m-K
• Electromagnetic Interference
(EMI) absorbing
• Highly conformable, low hardness
• Fiberglass reinforced for puncture,
shear and tear resistance
• Electrically isolating
Gap Pad^® EMI 1.0 is a highly conformable,
combination gap filling material offering
both thermal conductivity performance and
Electromagnetic Energy absorption (cavity
resonances and/or cross-talk causing
Electromagnetic Interference) at
frequencies of 1GHz and higher.
The material offers EMI suppression and
1.0 W/m-K thermal conductivity
performance with low assembly stress.
The soft nature of the material enhances
wet-out at the interface resulting in better
thermal performance than harder materials
with a similar performance rating.
Gap Pad^® EMI 1.0 has an inherent, natural
tack on one side of the material eliminating
the need for thermally-impeding adhesive
layers and allowing improved handling
during placement and assembly. The other
side is tack-free, again enhancing handling
and rework, if required. Gap Pad^® EMI 1.0
is supplied with a protective liner on the
material’s tacky side.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP PAD EMI 1.0
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Black
Black
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
Inherent Surface Tack
1
1
—
Density (Bulk Rubber) (g/cc)
2.4
2.4
ASTM D792
Heat Capacity (J/g-K)
1.3
1.3
ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1)
5
5
ASTM D2240
Young's Modulus (psi) / (kPa) (2)
10
69
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>1700
>1700
ASTM D149
Dielectric Constant (1000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ohm-meter)
10¹⁰
10¹⁰
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (3)
1.0
1.0
ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain)
10
20
30
Thermal Impedance (°C-in²/W) 0.040"
1.53
1.40
1.25
EMI PERFORMANCE (ASTM D-5568-01 TEST METHOD)
Absorption (4) dB/inch dB/cm
@ 2.4 GHz
-7
-2.8
@ 5 GHz
-14
-5.5
1) Thirty second delay value Shore 00 hardness scale.
2) Young’s Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch².
Relaxation stress @ 40 mil.
3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are
provided for reference only. Actual application performance is directly related to the surface roughness, flatness and
pressure applied.
4) Based on waveguide testing with 60 mil thickness testing.
TYPICAL APPLICATIONS INCLUDE
• Consumer electronics
• ASICs and DSPs
• Telecommunications
• PC applications
CONFIGURATIONS AVAILABLE
• Sheet form and die-cut parts
140
120
100
80
60
40
20
0
0
Thickness vs.Thermal Resistance
Gap Pad EMI 1.0
1.00
2.00
3.00
4.00
5.00
6.00
Thermal Resistance (C-in²/W)
Absorption and Reflection (60 mil)
Gap Pad EMI 1.0
0
-2
-4
-6
-8
-10
-12
-14
-16
0
1
2
3
4
5
6
7
8
Frequency (GHz)
PDS_GP_EMI 1_0515