GP-A3000 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Thermal conductivity: 2.6 W/m-K

Gap Pad^® A3000
July 2011
PRODUCT DESCRIPTION
Thermally Conductive, Reinforced
Gap Filling Material
FEATURES AND BENEFITS
• Thermal conductivity: 2.6 W/m-K
• Fiberglass reinforced for puncture,
shear and tear resistance
• Reduced tack on one side to aid in
application assembly
• Electrically isolating
Gap Pad^® A3000 is a thermally conductive,
filled-polymer laminate, supplied on a
reinforcing mesh for added electrical
isolation, easy material handling and
enhanced puncture, shear and tear
resistance. Gap Pad^® A3000 has a
reinforcement layer on the dark gold
side of the material that assists in burn-in
and rework processes while the light gold
and soft side of the material allows for
added compliance.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP PAD A3000
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Gold
Gold
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.015 to 0.125
0.381 to 3.175
ASTM D374
Inherent Surface Tack (1 side)
1
1
—
Density (Bulk Rubber) (g/cc)
3.2
3.2
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1)
80
80
ASTM D2240
Young's Modulus (psi) / (kPa) (2)
50
344
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>5000
>5000
ASTM D149
Dielectric Constant (1000 Hz)
7.0
7.0
ASTM D150
Volume Resistivity (Ohm-meter)
10¹⁰
10¹⁰
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
2.6
2.6
ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain)
10
20
30
Thermal Impedance (°C-in²/W) 0.040" (3) 0.78
0.73
0.68
1) Thir ty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain
with a sample size of 0.79 inch². 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Computer and peripherals
• Telecommunications
• Heat pipe assemblies
• RDRAM™ memory modules
• CDROM/DVD cooling
• Between CPU and heat spreader
• Area where heat needs to be transferred to a frame, chassis or other
type of heat spreader
CONFIGURATIONS AVAILABLE
• Sheet form, die-cut parts and roll form (converted or unconverted)
Thickness vs. Thermal Resistance
Gap Pad A3000
125
115
95
75
55
35
0.10 0.30 0.50 0.70 0.90 1.10 1.30 1.50 1.70
Thermal Resistance (C-in²/W)
PDS_GP_A3000_0711