GP-5000S35 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – High thermal conductivity: 5.0 W/m-K

Gap Pad^® 5000S35
January 2015
PRODUCT DESCRIPTION
High thermal conductivity plus “S-Class”
softness and conformability
FEATURES AND BENEFITS
• High thermal conductivity: 5.0 W/m-K
• Highly conformable, “S-Class” softness
• Natural inherent tack reduces interfacial
thermal resistance
• Conforms to demanding contours and
maintains structural integrity with little
or no stress applied to fragile
component leads
• Fiberglass reinforced for puncture,
shear and tear resistance
• Excellent thermal performance at
low pressures
Gap Pad^® 5000S35 is a fiberglass-
reinforced filler and polymer featuring a
high thermal conductivity. The material
yields extremely soft characteristics while
maintaining elasticity and conformability.
The fiberglass reinforcement provides
easy handling and converting, added
electrical isolation and tear resistance. The
inherent natural tack on both sides assists
in application and allows the product to
effectively fill air gaps, enhancing the
overall thermal performance. The
top side has reduced tack for ease of
handling. Gap Pad^® 5000S35 is ideal
for high-performance applications at low
mounting pressures.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP PAD 5000S35
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Light Green
Light Green
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
Inherent Surface Tack (1 side)
2
2
—
Density (Bulk Rubber) (g/cc)
3.6
3.6
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1)
35
35
ASTM D2240
Young's Modulus (psi) / (kPa) (2)
17.5
121
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>5000
>5000
ASTM D149
Dielectric Constant (1000 Hz)
7.5
7.5
ASTM D150
Volume Resistivity (Ohm-meter)
10⁹
10⁹
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
5.0
5.0
ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain)
10
20
30
Thermal Impedance (°C-in²/W) 0.040" (3) 0.41
0.34
0.30
1) Thirty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain
with a sample size of 0.79 inch². 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Voltage Regulator Modules (VRMs) and POLs
• CD ROM/DVD ROM
• Memory packages/modules
• PC Board to chassis
• Thermally-enhanced BGAs
• ASICs and DSPs
CONFIGURATIONS AVAILABLE
• Die-cut parts are available in any shape or size, separated or in sheet form
PDS_GP_5000S35_0115