GP-3500ULM Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Thermal Conductivity: 3.5 W/m-K

Gap Pad^® 3500ULM
December 2014
PRODUCT DESCRIPTION
Highly Conformable, Thermally
Conductive, Ultra-Low Modulus Material
FEATURES AND BENEFITS
• Thermal Conductivity: 3.5 W/m-K
• Fiberglass reinforced for shear and
tear resistance
• Non-fiberglass option for applications
that require an additional reduction
in stress
Gap Pad^® 3500ULM (ultra-low modulus) is
an extremely soft gap filling material with a
thermal conductivity of 3.5 W/m-K. The
material offers exceptional thermal
performance at low pressures due to
a unique 3.5 W/m-K filler package and
ultra-low modulus resin formulation. The
enhanced material is well suited for high
performance applications requiring
extremely low assembly stress.
Gap Pad^® 3500ULM maintains a
conformable nature that allows for
excellent interfacing and wet-out
characteristics, even to surfaces with high
roughness and/or topography.
Gap Pad^® 3500ULM is offered with and
without fiberglass and has higher natural
inherent tack on one side of the material,
eliminating the need for thermally-
impeding adhesive layers. The top side
has minimal tack for ease of handling.
Gap Pad^® 3500ULM is supplied with
protective liners on both sides.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP PAD 3500ULM
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Gray
Gray
Visual
Reinforcement Carrier
Fiberglass or
No fiberglass
Fiberglass or
No fiberglass
—
Thickness (inch) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
Inherent Surface Tack
2
2
—
Density (Bulk Rubber) (g/cc)
3.1
3.1
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Young's Modulus (psi) / (kPa) (1) (2)
4
27.5
—
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Dielectric Constant (1000 Hz) (3)
Volume Resistivity (Ohm-meter)
Flame Rating
>5000
6.0
10¹⁰
V-O
>5000
6.0
10¹⁰
V-O
ASTM D149
ASTM D150
ASTM D257
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
3.5
3.5
ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain)
10
20
30
Thermal Impedance (°C-in²/W) 0.040" (4) 0.50
0.44
0.39
1) Young’s Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch² after 5 minutes of
compression at 10% strain on a 1mm thickness material.
2) Thirty second delay value Shore 000 hardness scale is 70 for 125 mil.
3) Minimum value at 20 mil.
4) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are
provided for reference only. Actual application performance is directly related to the surface roughness, flatness and
pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Consumer electronics
• ASICs and DSPs
• Telecommunications
• PC applications
CONFIGURATIONS AVAILABLE
• Sheet form and die-cut parts
140
120
100
80
60
40
20
0
.25
Thickness vs. Thermal Resistance
Gap Pad 3500ULM
.50 .75 1.00 1.25 1.50 1.75 2.00
Thermal Resistance (C-in²/W)
PDS_GP_3500ULM_1214