GP-2000S40 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Highly conformable, low hardness

Gap Pad^® 2000S40
July 2011
PRODUCT DESCRIPTION
Highly Conformable,Thermally Conductive,
Reinforced “S-Class” Gap Filling Material
FEATURES AND BENEFITS
• Thermal conductivity: 2.0 W/m-K
• Low “S-Class” thermal resistance at very
low pressures
• Highly conformable, low hardness
• Designed for low-stress applications
• Fiberglass reinforced for puncture,
shear and tear resistance
Gap Pad^® 2000S40 is recommended for
low-stress applications that require a mid
to high thermally conductive interface
material.The highly conformable nature
of the material allows the pad to fill in air
voids and air gaps between PC boards
and heat sinks or metal chassis with
stepped topography, rough surfaces and
high stack-up tolerances.
Gap Pad^® 2000S40 is offered with inherent
natural tack on both sides of the material
allowing for stick-in-place characteristics
during application assembly.The material
is supplied with protective liners on both
sides.The top side has reduced tack for
ease of handling.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP PAD 2000S40
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Gray
Gray
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
Inherent Surface Tack (1 side)
2
2
—
Density (Bulk Rubber) (g/cc)
2.9
2.9
ASTM D792
Heat Capacity (J/g-K)
0.6
0.6
ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1)
30
30
ASTM D2240
Young's Modulus (psi) / (kPa) (2)
45
310
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>5000
>5000
ASTM D149
Dielectric Constant (1000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ohm-meter)
10¹¹
10¹¹
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
2.0
2.0
ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain)
10
20
30
Thermal Impedance (°C-in²/W) 0.040" (3) 0.97
0.89
0.80
1) Thir ty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain
with a sample size of 0.79 inch². 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Power electronics DC/DC; 1/4, 1/2, full bricks, etc.
• Mass storage devices
• Graphics card/processor/ASIC
• Wireline/wireless communications hardware
• Automotive engine/transmission controls
CONFIGURATIONS AVAILABLE
• Sheet form and die-cut parts
Thickness vs. Thermal Resistance
Gap Pad 2000S40
125
100
75
50
25
0
0.20 0.50 1.00 1.50 2.00 2.50
Thermal Resistance (C-in²/W)
PDS_GP_2000S40_0711