GP-1500S30 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Decreased strain on fragile components

Gap Pad^® 1500S30
September 2014
PRODUCT DESCRIPTION
Highly Conformable, Thermally Conductive,
Reinforced “S-Class” Gap Filling Material
FEATURES AND BENEFITS
• Thermal conductivity: 1.3 W/m-K
• Highly conformable / low hardness
• Decreased strain on fragile components
• Fiberglass reinforced for puncture,
shear and tear resistance
• Quick rebound to original shape
Gap Pad^® 1500S30 is a highly compliant
Gap Pad^® material that is ideal for
fragile component leads. The material is
fiberglass reinforced for improved
puncture resistance and handling
characteristics. Gap Pad^® 1500S30
maintains a conformable, yet elastic
nature that provides excellent interfacing
and wet-out characteristics, even to
surfaces with high roughness or
uneven topography.
Gap Pad^® 1500S30 features an inherent
tack on both sides of the material,
eliminating the need for thermally
impeding adhesive layers.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP PAD 1500S30
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Light Pink
Light Pink
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
ASTM D374
Thickness (inch) / (mm)
0.020 to 0.250
0.508 to 6.350
ASTM D374
Inherent Surface Tack (1 side)
2
2
—
Density (Bulk Rubber) (g/cc)
1.8
1.8
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1)
30
30
ASTM D2240
Young's Modulus (psi) / (kPa) (2)
16
110
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>6000
>6000
ASTM D149
Dielectric Constant (1000 Hz)
5.0
5.0
ASTM D150
Volume Resistivity (Ohm-meter)
10¹¹
10¹¹
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
1.3
1.3
ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain)
10
20
30
Thermal Impedance (°C-in²/W) 0.040" (3) 1.69
1.41
1.26
1) Thirty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain
with a sample size of 0.79 inch². 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Any heat-generating component and a heat sink
• Computers and peripherals
• Telecommunications
• Between any heat-generating semiconductor and a heat sink
• Shielding devices
CONFIGURATIONS AVAILABLE
• Sheet form and die-cut parts
Thickness vs. Thermal Resistance
Gap Pad 1500S30
250
200
160
125
100
80
60
40
20
0
0.61 1.21 1.82 2.42 3.03 3.79 4.85 6.06 7.57
Thermal Resistance (C-in²/W)
PDS_GP_1500S30_0914