GP-1500R Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Easy release construction

Gap Pad^® 1500R
July 2011
PRODUCT DESCRIPTION
Thermally Conductive, Reinforced
Gap Filling Material
FEATURES AND BENEFITS
• Thermal conductivity: 1.5 W/m-K
• Fiberglass reinforced for puncture,
shear and tear resistance
• Easy release construction
• Electrically isolating
Gap Pad^® 1500R has the same highly
conformable, low-modulus polymer as the
standard Gap Pad^® 1500.The fiberglass
reinforcement allows for easy material
handling and enhances puncture, shear
and tear resistance.The natural tack on
both sides of the material allows for good
compliance to mating surfaces of
components, further reducing
thermal resistance.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP PAD 1500R
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Black
Black
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.010 to 0.020
0.254 to 0.508
ASTM D374
Inherent Surface Tack (1 side)
2
2
—
Density (Bulk Rubber) (g/cc)
2.1
2.1
ASTM D792
Heat Capacity (J/g-K)
1.3
1.3
ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1)
40
40
ASTM D2240
Young's Modulus (psi) / (kPa) (2)
45
310
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>6000
>6000
ASTM D149
Dielectric Constant (1000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ohm-meter)
10¹¹
10¹¹
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
1.5
1.5
ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain)
10
20
30
Thermal Impedance (°C-in²/W) 0.020" (3) 1.07
0.88
0.82
1) Thir ty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain
with a sample size of 0.79 inch². 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Telecommunications
• Computer and peripherals
• Power conversion
• RDRAM™ memory modules/chip scale packages
• Areas where heat needs to be transferred to a frame chassis or other
type of heat spreader
CONFIGURATIONS AVAILABLE
• Sheet form, die-cut parts, and roll form (converted or unconverted)
Thickness vs. Thermal Resistance
Gap Pad 1500R
20
18
16
14
12
10
0.25 0.30 0.35 0.40 0.45 0.50 0.55
Thermal Resistance (C-in²/W)
PDS_GP_1500R_0711