GP-1500 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Conformable, low hardness

Gap Pad^® 1500
July 2011
PRODUCT DESCRIPTION
Thermally Conductive, Un-Reinforced
Gap Filling Material
FEATURES AND BENEFITS
• Thermal conductivity: 1.5 W/m-K
• Un-reinforced construction for
additional compliancy
• Conformable, low hardness
• Electrically isolating
Gap Pad^® 1500 has an ideal filler blend
that gives it a low-modulus characteristic
that maintains optimal thermal
performance yet still allows for easy
handling.The natural tack on both sides
of the material allows for good compliance
to adjacent surfaces of components,
minimizing interfacial resistance.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP PAD 1500
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Black
Black
Visual
Reinforcement Carrier
—
—
—
Thickness (inch) / (mm)
0.020 to 0.200
0.508 to 5.080
ASTM D374
Inherent Surface Tack (1 sided)
2
2
—
Density (Bulk Rubber) (g/cc)
2.1
2.1
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1)
40
40
ASTM D2240
Young's Modulus (psi) / (kPa) (2)
45
310
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>6000
>6000
ASTM D149
Dielectric Constant (1000 Hz)
5.5
5.5
ASTM D150
Volume Resistivity (Ohm-meter)
10¹¹
10¹¹
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
1.5
1.5
ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain)
10
20
30
Thermal Impedance (°C-in²/W) 0.040" (3) 1.62
1.50
1.33
1) Thir ty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain
with a sample size of 0.79 inch². 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the sur-
face roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Telecommunications
• Computer and peripherals
• Power conversion
• RDRAM™ memory modules/chip scale packages
• Areas where heat needs to be transferred to a frame chassis or other
type of heat spreader
CONFIGURATIONS AVAILABLE
• Sheet form and die-cut parts
Thickness vs. Thermal Resistance
Gap Pad 1500
200
150
100
50
0
0123456
Thermal Resistance (C-in²/W)
PDS_GP_1500_0711