GP-1450 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – PEN film reinforcement allows easy

Gap Pad^® 1450
August 2013
PRODUCT DESCRIPTION
Highly Conformable,Thermally Conductive,
Reworkable Gap Filling Material
FEATURES AND BENEFITS
• Thermal Conductivity: 1.3 W/m-K
(Bulk Rubber)
• PEN film reinforcement allows easy
rework and resistance to puncture and
tear resistance
• Highly conformable/low hardness
• Low strain on fragile components
Gap Pad^® 1450 is a highly compliant
Gap Pad^® material that is ideal for fragile
component leads. The material includes a
PEN film, which facilitates rework and
improves puncture resistance and
handling characteristics. The tacky side of
Gap Pad^® 1450 maintains a conformable,
yet elastic nature that provides excellent
interfacing and wet-out characteristics,
even to surfaces with high roughness or
uneven topography.
Gap Pad^® 1450 has inherent tack on one
side of the material, eliminating the need
for thermally impeding adhesive layers.
It is highly recommended that the PEN film
be left intact. However, film removal will
not have a significant impact on thermal
performance.
Please contact your local Bergquist Sales
Representative for sample inquiries and
additional product information.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP PAD 1450
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Light Pink
Light Pink
Visual
Reinforcement Carrier
PEN film
PEN film
—
Thickness (inch) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
Inherent Surface Tack (1 side)
1
1
—
Density (Bulk Rubber) (g/cc)
1.8
1.8
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1)
30
30
ASTM D2240
Young's Modulus (psi) / (kPa) (2)
16
110
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 302
-60 to 150
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Dielectric Constant (1000 Hz)
Volume Resistivity (Ohm-meter)
Flame Rating
>6000
5.0
10⁹
V-0
>6000
5.0
10⁹
V-0
ASTM D149
ASTM D150
ASTM D257
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
1.3
1.3
ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch ².
TYPICAL APPLICATIONS INCLUDE
• Lighting and LED applications
• Low strain is required for fragile component leads
• Computer and peripherals
• Telecommunications
• Between any heat-generating semiconductor and a heat sink
CONFIGURATIONS AVAILABLE
• Sheet form and die-cut parts
PDS_GP_1450_0813