GP-1000SF Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – No silicone outgassing

Gap Pad^® 1000SF
July 2011
PRODUCT DESCRIPTION
Thermally Conductive, Silicone-Free
Gap Filling Material
FEATURES AND BENEFITS
• Thermal conductivity: 0.9 W/m-K
• No silicone outgassing
• No silicone extraction
• Reduced tack on one side to aid in
application assembly
• Electrically isolating
The new Gap Pad^® 1000SF is a thermally
conductive, electrically insulating, silicone-
free polymer specially designed for
silicone-sensitive applications.The material
is ideal for applications with high standoff
and flatness tolerances. Gap Pad^® 1000SF
is reinforced for easy material handling
and added durability during assembly.The
material is available with a protective liner
on both sides of the material.The topside
has reduced tack for ease of handling.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP PAD 1000SF
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Green
Green
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.010 to 0.125 0.254 to 3.175
ASTM D374
Inherent Surface Tack (1- or 2-sided)
2
2
—
Density (g/cc)
2.0
2.0
ASTM D792
Heat Capacity (J/g-K)
1.1
1.1
ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1)
40
40
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
34
234
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 257
-60 to 125
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>6000
>6000
ASTM D149
Dielectric Constant (1000 Hz)
5.0
5.0
ASTM D150
Volume Resistivity (Ohm-meter)
10¹⁰
10¹⁰
ASTM D257
Flame Rating
V-1
V-1
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
0.9
0.9
ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch². For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
TYPICAL APPLICATIONS INCLUDE
• Digital disk drives / CD-ROM
• Automotive modules
• Fiber optics modules
CONFIGURATIONS AVAILABLE
• Sheet form and die-cut parts
Thickness vs. Thermal Resistance
Gap Pad 1000SF
125
100
75
50
25
0
0
1
2
3
4
5
Thermal Resistance (C-in²/W)
PDS_GP_1000SF_0711