GF4000 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Ultra-conforming with excellent wet-out

Gap Filler 4000 (Two-Part)
January 2015
PRODUCT DESCRIPTION
Thermally Conductive, Liquid
Gap Filler Material
FEATURES AND BENEFITS
• Thermal Conductivity: 4.0 W/m-K
• Extended working time for
manufacturing flexibility
• Ultra-conforming with excellent wet-out
• 100% solids - no cure by-products
• Excellent low and high temperature
chemical and mechanical stability
Gap Filler 4000 is a two-part, high
performance, thermally conductive, liquid
gap filling material. The mixed material will
cure at room temperature and can be
accelerated with the addition of heat.
Gap Filler 4000 offers an extended
working time to allow greater flexibility in
the customer’s assembly process.
Liquid dispensed thermal materials offer
infinite thickness variations and impart
little to no stress on sensitive components
during assembly. Gap Filler 4000 exhibits
low level natural tack characteristics and
is intended for use in applications where a
strong structural bond is not required.
As cured, Gap Filler 4000 provides a
soft, thermally conductive, form-in-place
elastomer that is ideal for fragile
assemblies or for filling unique and
intricate air voids and gaps.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP FILLER 4000
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color / Part A
Blue
Blue
Visual
Color / Part B
White
White
Visual
Viscosity, High Shear (Pa-s) (1)
50
50
ASTM D5099
Density (g/cc)
3.1
3.1
ASTM D792
Mix Ratio
1:1
1:1
—
Shelf Life @ 25°C (months)
5
5
—
PROPERTY AS CURED
Color
Blue
Blue
Visual
Hardness (Shore 00) (2)
75
75
ASTM D2240
Heat Capacity (J/g-K)
0.8
0.8
ASTM D1269
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL AS CURED
Dielectric Strength (V/mil)
450
450
ASTM D149
Dielectric Constant (1000 Hz)
7.9
7.9
ASTM D150
Volume Resistivity (Ohm-meter)
10¹⁰
10¹⁰
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K)
4.0
4.0
ASTM D5470
CURE SCHEDULE
Working Time @ 25°C (3)
240 min (4 hrs) 240 min (4 hrs)
-
Cure @ 25°C (hrs) (3)
24
24
-
Cure @ 100°C (min) (3)
30
30
-
1) Capillary Viscosity, 1500/sec, Part A and B measured separately.
2) Thirty second delay value Shore 00 hardness scale.
3) Parallel plate rheometer, see reactivity application note.
TYPICAL APPLICATIONS INCLUDE
• Automotive electronics
• Computer and peripherals
• Between any heat-generating semiconductor and a heat sink
• Telecommunications
CONFIGURATIONS AVAILABLE
• Supplied in cartridge or kit form
PDS_GF_4000_0115