GF3500S35 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Two-part formulation for easy storage

Gap Filler 3500S35 (Two-Part)
February 2015
PRODUCT DESCRIPTION
Thermally Conductive, Liquid
Gap Filling Material
FEATURES AND BENEFITS
• Thermal Conductivity: 3.6 W/m-K
• Thixotropic nature makes it easy
to dispense
• Two-part formulation for easy storage
• Ultra-conforming - designed for fragile
and low stress applications
• Ambient or accelerated cure schedules
Gap Filler 3500S35 is a two-component
liquid gap filling material, cured at either
room or elevated temperature, featuring
ultra-high thermal performance and
superior softness. Prior to curing, the
material maintains good thixotropic
characteristics as well as low viscosity. The
result is a gel-like liquid material designed
to fill air gaps and voids yet flow when
acted upon by an external force (e.g.
dispensing or assembly process). The
material is an excellent solution for
interfacing fragile components with high
topography and/or stack-up tolerances
to a universal heat sink or housing. Once
cured, it remains a low modulus elastomer
designed to assist in relieving CTE stresses
during thermal cycling yet maintain enough
modulus to prevent pump-out from the
interface. Gap Filler 3500S35 will lightly
adhere to surfaces, thus improving surface
area contact. Gap Filler 3500S35 is not
designed to be a structural adhesive.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP FILLER 3500S35
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color / Part A
White
White
Visual
Color / Part B
Blue
Blue
Visual
Viscosity as Mixed (cps) (1)
150,000
150,000
ASTM D2196
Density (g/cc)
3.0
3.0
ASTM D792
Mix Ratio
1:1
1:1
—
Shelf Life @ 25°C (months)
5
5
—
PROPERTY AS CURED
Color
Blue
Blue
Visual
Hardness (Shore 00) (2)
35
35
ASTM D2240
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL AS CURED
Dielectric Strength (V/mil)
275
275
ASTM D149
Dielectric Constant (1000 Hz)
8.0
8.0
ASTM D150
Volume Resistivity (Ohm-meter)
10⁹
10⁹
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K)
3.6
3.6
ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (min) (3)
60
60
—
Cure @ 25°C (hrs) (4)
15
15
—
Cure @ 100°C (min) (4)
30
30
—
1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25°C.
2) Thirty second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Cure schedule (rheometer - time to read 90% cure)
TYPICAL APPLICATIONS INCLUDE
• Automotive electronics
• PCBA to housing
• Discrete components to housing
• Fiber optic telecommunications equipment
CONFIGURATIONS AVAILABLE
• Supplied in cartridge and kit form
PDS_GF_3500S35_0215