GF2000 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Ambient and accelerated cure schedules

Gap Filler 2000 (Two-Part)
September 2013
PRODUCT DESCRIPTION
Thermally Conductive, Liquid
Gap Filling Material
FEATURES AND BENEFITS
• Thermal conductivity: 2.0 W/m-K
• Ultra-conforming, designed for fragile
and low-stress applications
• Ambient and accelerated cure schedules
• 100% solids – no cure by-products
• Excellent low and high temperature
mechanical and chemical stability
Gap Filler 2000 is a high performance,
thermally conductive, liquid gap filling
material supplied as a two-component, room
or elevated temperature curing system.The
material provides a balance of cured
material properties and good compression
set (memory).The result is a soft, form-in-
place elastomer ideal for coupling “hot”
electronic components mounted on PC
boards with an adjacent metal case or heat
sink. Before cure, it flows under pressure
like grease.After cure, it won’t pump from the
interface as a result of thermal cycling and is
dry to the touch.
Unlike cured Gap Filling materials, the liquid
approach offers infinite thickness with little or
no stress during displacement and assembly.
It also eliminates the need for specific pad
thickness and die-cut shapes for individual
applications.
Gap Filler 2000 is intended for use in
thermal interface applications when a strong
structural bond is not required. As cured,
Gap Filler 2000 is formulated to have pliable
low-modulus, properties.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP FILLER 2000
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color / Part A
Pink
Pink
Visual
Color / Part B
White
White
—
Viscosity as Mixed (cps)⁽¹⁾
300,000
300,000
ASTM D2196
Density (g/cc)
2.9
2.9
ASTM D792
Mix Ratio
1:1
1:1
—
Shelf Life @ 25°C (months)
6
6
—
PROPERTY AS CURED
Color
Hardness (Shore 00)⁽²⁾
Heat Capacity (J/g-K)
Continuous Use Temp (°F) / (°C)
Pink
70
1.0
-76 to 392
Pink
70
1.0
-60 to 200
Visual
ASTM D2240
ASTM D1269
—
ELECTRICAL AS CURED
Dielectric Strength (V/ml)
Dielectric Constant (1000 Hz)
500
500
ASTM D149
7
7
ASTM D150
Volume Resistivity (Ohm-meter)
10¹¹
10¹¹
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K)
2.0
2.0
ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C ⁽³⁾
Cure @ 25°C ⁽⁴⁾
Cure @ 100°C ⁽⁴⁾
SCHEDULE 1
15 min
1-2 hours
5 min
SCHEDULE 2
60 min
3-4 hours
15 min
SCHEDULE 3
600 min (10 hr)
3 days
1 hour
1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25°C.
2) Thirty second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Cure schedule (rheometer - time to read 90% cure)
TYPICAL APPLICATIONS INCLUDE
• Automotive electronics
• Telecommunications
• Computer and peripherals
• Thermally conductive vibration dampening
• Between any heat-generating semiconductor and a heat sink
CONFIGURATIONS AVAILABLE
• Supplied in cartridge and kit form
PDS_GF_2000_0913