GF1500 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Excellent slump resistance

Gap Filler 1500 (Two-Part)
March 2012
PRODUCT DESCRIPTION
Thermally Conductive Liquid
Gap Filling Material
FEATURES AND BENEFITS
• Thermal conductivity: 1.8 W/mK
• Optimized shear thinning characteristics
for ease of dispensing
• Excellent slump resistance (stays
in place)
• Ultra-conforming with excellent wet-out
for low stress interface applications
• 100% solids – no cure by-products
• Excellent low and high temperature
mechanical and chemical stability
Gap Filler 1500 is a two-part, high
performance, thermally conductive liquid
gap filling material, which features superior
slump resistance and high shear thinning
characteristics for optimized consistency
and control during dispensing.The
mixed system will cure at room
temperature and can be accelerated with
the addition of heat. Unlike cured thermal
pad materials, a liquid approach offers
infinite thickness variations with little or
no stress to the sensitive components
during assembly. Gap Filler 1500 exhibits
low level natural tack characteristics and
is intended for use in applications where
a strong structural bond is not required.
As cured, Gap Filler 1500 provides a soft,
thermally conductive, form-inplace
elastomer that is ideal for fragile
assemblies and filling unique and
intricate air voids and gaps.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP FILLER 1500
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color / Part A
Yellow
Yellow
Visual
Color / Part B
White
White
Visual
Viscosity, High Shear (Pa-s)(1)
25
25
ASTM D5099
Density (g/cc)
2.7
2.7
ASTM D792
Mix Ratio
1:1
1:1
—
Shelf Life @ 25°C (months)
6
6
—
PROPERTY AS CURED
Color
Yellow
Yellow
Visual
Hardness (Shore 00)(2)
50
50
ASTM D2240
Heat Capacity (J/g-K)
1.0
1.0
ASTM D1269
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL AS CURED
Dielectric Strength (V/mil)
400
400
ASTM D149
Dielectric Constant (1000 Hz)
6.4
6.4
ASTM D150
Volume Resistivity (Ohm-meter)
10¹⁰
10¹⁰
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K)
1.8
1.8
ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (3)
Cure @ 25°C (4)
Cure @ 100°C (4)
SCHEDULE 1 SCHEDULE 2
60 min
480 min (8 hr)
-
5 hours
3 days
-
10 min
30 min
-
1) Capillary viscosity, initial, 3000 sec^-1. Part A and B measured separately
2) Thirty second delay value Shore 00 hardness scale.
3) Parallel Plate Rheometer - Working life as liquid.
4) Parallel Plate Rheometer - Estimated time to read 90% cure.
TYPICAL APPLICATIONS INCLUDE
• Automotive electronics
• Telecommunications
• Computer and peripherals
• Between any heat-generating semiconductor and a heat sink
CONFIGURATIONS AVAILABLE
• Supplied in cartridge and kit form
• With or without glass beads
PDS_GF_1500_0312