GF1100SF Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Ambient and accelerated cure schedules

Gap Filler 1100SF (Two-Part)
July 2012
PRODUCT DESCRIPTION
Thermally Conductive, Silicone-Free,
Liquid Gap Filling Material
FEATURES AND BENEFITS
• Thermal conductivity: 1.1 W/m-K
• No silicone outgassing or extraction
• Ultra-conforming, designed for fragile
and low-stress applications
• Ambient and accelerated cure schedules
• 100% solids – no cure by-products
Gap Filler 1100SF is the thermal solution
for silicone-sensitive applications.The
material is supplied as a two-part
component, curing at room or elevated
temperatures.The material exhibits low
modulus properties then cures to a soft,
flexible elastomer, helping reduce thermal
cycling stresses during operation and
virtually eliminating stress during assembly
of low-stress applications.
The two components are colored to
assist as a mix indicator (1:1 by volume).
The mixed system will cure at ambient
temperature. Unlike cured thermal pad
materials, the liquid approach offers infinite
thickness variations with little or no stress
during assembly displacement.
Gap Filler 1100SF, although exhibiting
some natural tack characteristics, is not
intended for use in thermal interface
applications requiring a mechanical
structural bond.
Application
Gap Filler 1100SF can be mixed and
dispensed using dual-tube cartridge packs
with static mixers and manual or
pneumatic gun or high volume mixing and
dispensing equipment (application of heat
may be used to reduce viscosity).
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP FILLER 1100SF
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color / Part A
Yellow
Yellow
Visual
Color / Part B
Red
Red
Visual
Viscosity as Mixed (cps) (1)
450,000
450,000
ASTM D2196
Density (g/cc)
2.0
2.0
ASTM D792
Mix Ratio
1:1
1:1
—
Shelf Life @ 25°C (months)
6
6
—
PROPERTY AS CURED
Color
Orange
Orange
Visual
Hardness (Shore 00) (2)
60
60
ASTM D2240
Heat Capacity (J/g-K)
0.9
0.9
ASTM E1269
Continuous Use Temp (°F) / (°C)
-76 to 257
-60 to 125
—
ELECTRICAL AS CURED
Dielectric Strength (V/mil)
400
400
ASTM D149
Dielectric Constant (1000 Hz)
5.0
5.0
ASTM D150
Volume Resistivity (Ohm-meter)
10¹⁰
10¹⁰
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K)
1.1
1.1
ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (3)
240 min (4 hr) 240 min (4 hr)
—
Cure @ 25°C (hrs) (4)
24
24
—
Cure @ 100°C (min) (4)
10
10
—
1) Brookfield RV, Heli-Path, Spindle TF @ 2 rpm, 25°C.
2) Thirty second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Cure schedule (rheometer - time to read 90% cure)
TYPICAL APPLICATIONS INCLUDE
• Hard disk assemblies
• Silicone-sensitive optic components
• Silicone-sensitive electronics
• Dielectric for bare-leaded devices
• Filling various gaps between heat-generating devices to heat sinks and housings
• Mechanical switching relay
CONFIGURATIONS AVAILABLE
• Supplied in cartridge and kit form
TEMPERATURE DEPENDENCE OF VISCOSITY
The viscosity of the Gap Filler 1100SF material is tempera-
ture dependent.The table below provides the multiplication
factor to obtain viscosity at various temperatures.To obtain
the viscosity at a given temperature, look up the multiplica-
tion factor at that temperature and multiply the corre-
sponding viscosity at 25°C.
Temperature
°C
20
25
35
45
50
Multiplication Factor
Part A
Part B
1.43
1.57
1.00
1.00
0.58
0.50
0.39
0.30
0.32
0.24
Example - Viscosity of Part A @ 45°:
Viscosity of Part A at 25°C is 450,000 cp. The multipli-
cation factor for part A at 45°C is 0.39. Therefore:
(450,000) x (0.39) = 175,500 cps
PDS_GF_1100SF_0712