GF1000SR Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Excellent slump resistance

Gap Filler 1000SR (Two-Part)
September 2011
PRODUCT DESCRIPTION
Thermally Conductive, Liquid
Gap Filler Material
FEATURES AND BENEFITS
• Thermal Conductivity: 1.0 W/m-K
• Excellent slump resistance (stays in place)
• Ultra-conforming, with excellent wet-out
for low stress interface applications
• 100% solids - no cure by-products
• Excellent low and high temperature
mechanical and chemical stability
Gap Filler 1000SR is a two-part, thermally
conductive, liquid gap filling material that
features superior slump resistance. The
mixed system will cure at room
temperature and can be accelerated with
the addition of heat.
Unlike cured thermal pad materials, a
liquid approach offers infinite thickness
variations with little or no stress to
sensitive components during assembly.
As cured, Gap Filler 1000SR provides a
soft, thermally conductive, form-in-place
elastomer that is ideal for fragile
assemblies or for filling unique and
intricate air voids and gaps.
Gap Filler 1000SR exhibits low level
natural tack characteristics and is
intended for use in applications where
a strong structural bond is not required.
TYPICAL PROPERTIES OF GAP FILLER 1000SR
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color / Part A
Violet
Violet
Visual
Color / Part B
White
White
Visual
Viscosity, High Shear (Pa-s) (1)
20
20
ASTM D5099
Density (g/cc)
2.0
2.0
ASTM D792
Mix Ratio
1:1
1:1
—
Shelf Life @ 25°C (months)
6
6
—
PROPERTY AS CURED
Color
Violet
Violet
Visual
Hardness (Shore 00) (2)
75
75
ASTM D2240
Heat Capacity (J/g-K)
1.0
1.0
ASTM D1269
Continuous Use Temp (°F) / (°C)
-76 to 347
-60 to 175
—
ELECTRICAL AS CURED
Dielectric Strength (V/mil)
500
500
ASTM D149
Dielectric Constant (1000 Hz)
5.1
5.1
ASTM D150
Volume Resistivity (Ohm-meter)
10¹¹
10¹¹
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K)
1.0
1.0
ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (min) (3)
60
60
-
Cure @ 25°C (hrs) (4)
20
20
-
Cure @ 100°C (min) (4)
10
10
-
1) Capillary Viscosity, Initial, 4500 sec^-1. Part A and B measured separately.
2) Thirty second delay value Shore 00 hardness scale.
3) ARES Parallel Plate Rheometer - Working life as liquid, time for modulus to double.
4) ARES Parallel Plate Rheometer - Estimated time to read 90% cure.
TYPICAL APPLICATIONS INCLUDE
• Automotive electronics
• Computer and peripherals
• Between any heat-generating semiconductor and a heat sink
• Telecommunications
CONFIGURATIONS AVAILABLE
• Supplied in cartridge or kit form
PDS_GF_1000SR_0911