GF1000 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Ambient and accelerated cure schedules

Gap Filler 1000 (Two-Part)
September 2013
PRODUCT DESCRIPTION
Thermally Conductive, Liquid Gap
Filling Material
FEATURES AND BENEFITS
• Thermal conductivity: 1.0 W/m-K
• Ultra-conforming, designed for fragile
and low-stress applications
• Ambient and accelerated cure schedules
• 100% solids – no cure by-products
• Excellent low and high temperature
mechanical and chemical stability
Gap Filler 1000 is a thermally conductive,
liquid gap filling material. It is supplied as
a two-component, room or elevated
temperature curing system. The
material is formulated to provide a balance
of cured material properties highlighted by
a low modulus and good compression set
(memory). The result is a soft, thermally
conductive, form-in-place elastomer ideal
for coupling “hot” electronic components
mounted on PC boards with an adjacent
metal case or heat sink. Before cure,
Gap Filler 1000 flows under pressure like
a grease. After cure, it does not pump from
the interface as a result of thermal cycling.
Unlike thermal grease, the cured product
is dry to the touch. Unlike cured gap filling
materials, the liquid approach offers infinite
thickness with little or no stress during
displacement and eliminates the need for
specific pad thickness and die-cut shapes
for individual applications. Gap Filler 1000
is intended for use in thermal interface
applications when a strong structural bond
is not required.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF GAP FILLER 1000
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color / Part A
Gray
Gray
Visual
Color / Part B
White
White
Visual
Viscosity as Mixed (cps) (1)
100,000
100,000
ASTM D2196
Density (g/cc)
1.6
1.6
ASTM D792
Mix Ratio
1:1
1:1
—
Shelf Life @ 25°C (months)
6
6
—
PROPERTY AS CURED
Color
Gray
Gray
Visual
Hardness (Shore 00) (2)
30
30
ASTM D2240
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Continuous Use Temp (°F) / (°C)
-76 to 347
-60 to 175
—
ELECTRICAL AS CURED
Dielectric Strength (V/mil)
500
500
ASTM D149
Dielectric Constant (1000 Hz)
5.0
5.0
ASTM D150
Volume Resistivity (Ohm-meter)
10¹¹
10¹¹
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K)
1.0
1.0
ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (min) (3)
15
15
—
Cure @ 25°C (min) (4)
60 - 120
60 - 120
—
Cure @ 100°C (min) (4)
5
5
—
1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25°C.
2) Thirty second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Cure schedule (rheometer - time to read 90% cure)
TYPICAL APPLICATIONS INCLUDE
• Automotive electronics
• Telecommunications
• Computer and peripherals
• Thermally conductive vibration dampening
• Between any heat-generating semiconductor and a heat sink
CONFIGURATIONS AVAILABLE
• Supplied in cartridge and kit form
PDS_GF_1000_0913