BP-LMS-HD Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Exceptional dielectric strength

Bond-Ply^® LMS-HD
October 2014
PRODUCT DESCRIPTION
Laminate Material - Silicone, High Durability,
Optional Lamination Methods
FEATURES AND BENEFITS
• TO-220 Thermal performance: 2.3°C/W,
initial pressure only lamination
• Exceptional dielectric strength
• Very low interfacial resistance
• 200 psi adhesion strength
• Continuous use of -60 to 180°C
• Eliminates mechanical fasteners
Bond-Ply^® LMS-HD is a thermally
conductive heat curable laminate material.
The product consists of a high
performance thermally conductive low
modulus silicone compound coated on a
cured core, and double lined with
protective films. The low modulus silicone
design effectively absorbs mechanical
stresses induced by assembly-level CTE
mismatch, shock and vibration while
providing exceptional thermal performance
(vs PSA technologies) and long-term
integrity. Bond-Ply^® LMS-HD will typically
be used for structurally adhering power
components and PCBs to a heat sink.
Shelf Life: Bond-Ply^® LMS-HD is a
heat-cured material and should be stored
in temperature controlled conditions. The
recommended storage temperature range
of 5-25°C should be used to maintain
optimum characteristics for a 5-month
shelf life.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF BOND-PLY LMS-HD
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Yellow
Yellow
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.010, 0.012
0.254, 0.305
ASTM D374
Continuous Use Temp (°F) / (°C)
-76 to 356
-60 to 180
—
ADHESION
Lap Shear @ RT (psi) / (MPa)
200
1.4
ASTM D1002
ELECTRICAL
VALUE
TEST METHOD
Breakdown Voltage, Sheet (Vac) (1)
5000
ASTM D149
Breakdown Voltage, Laminated (Vac) (2)
4000
ASTM D149
Dielectric Constant (1000 Hz)
5.0
ASTM D150
Volume Resistivity (Ohm-meter)
10¹¹
ASTM D257
Flame Rating
V-O
U.L. 94
THERMAL
Post-Cured Thermal Conductivity (W/m-K) (3)
1.4
ASTM D5470
THERMAL IMPEDANCE vs LAMINATION METHOD
Lamination Pressure (75 psi) (4)
Constant
IPO
TO-220 Thermal Performance (°C/W)
2.1
2.3
CURE SCHEDULE
Cure @ 125°C (minutes) (5)
30
30
Cure @ 160°C (minutes) (5)
6
6
1) The ASTM D149 test method on cured LMS-HD material. No pressure was applied to the LMS-HD during the cure cycle.
2) A 1/2" diameter probe was laminated with LMS-HD to a 2" X 2" plate at 200 psi for 30 seconds, then cured with no pressure
at 160°C for 6 minutes. The cured assembly was then tested per ASTM D149. This LMS-HD sample resembles a typical lamination
application.
3). The ASTM D5470 (Bergquist Modified) test procedure was used on post-cured LMS-HD material. The recorded value includes
interfacial thermal resistance. These values are given for customer reference only.
4). TO-220 Thermal Performance testing, per The Bergquist RD2010 specification for Laminates, was completed on laminated
TO-220 assemblies. Lamination was completed at 75 psi for 30 seconds for "IPO" (Initial Pressure Only) and at a constant 75 psi during
the lamination and curing process for "Constant". No additional pressure was applied during TO-220 thermal performance testing.
5). Cure Schedule – time after cure temperature is achieved at the interface. Ramp time is application dependent.
TYPICAL APPLICATIONS INCLUDE
• Discrete semi-conductor packages bonded to heat spreader or heat sink
CONFIGURATIONS AVAILABLE
• Roll form
• Sheet form
• Die-cut parts
Overall Uncured
Thickness
10 or 12 mil
Silicone
Dispersion
Liner
Cured Core
Liner
Fiberglass
Note: Not to scale
PDS_BP_LMS HD_October 2014