BP-LMS-500P Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Polyimide film provides high dielectric strength

Bond-Ply^® LMS 500P
April 2012
PRODUCT DESCRIPTION
Thermally Conductive, Polyimide Reinforced,
Laminate Material-Silicone
FEATURES AND BENEFITS
• Polyimide film provides high
dielectric strength
• Intended for secondary and primary
voltage power applications
• Reliable lap shear strength at
temperature extremes
• Quick cure rate
• Excellent CTE and shock/vibe absorption
Bond-Ply^® LMS 500P is a thermally
conductive laminate with a polyimide film
substrate.The product consists of a high
performance thermally conductive low
modulus silicone compound coated both
sides of a polyimide film, and double
lined with protective films.The low modulus
silicone design effectively absorbs
mechanical stresses induced by
assembly-level CTE mismatch and shock
and vibration while providing exceptional
thermal performance and long-term
adhesion and dielectric integrity.
Bond-Ply^® LMS 500P is typically used for
bonding power components and PCBs to
a heatsink. See application note for
lamination recommendations.
Shelf Life: The Bond-Ply^® LMS 500P is a
heat-cured material and should be stored
in temperature-controlled conditions. A
recommended storage temperature range
of 5-25°C should be used to maintain
optimum characteristics for 5 months.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF BOND-PLY LMS 500P
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color
Orange
Orange
Visual
Reinforcement Carrier
Polyimide Film
Polyimide Film
—
Thickness (inch) / (mm)
0.008
0.203
ASTM D374
ADHESION
Lap Shear @ RT (psi) / (MPa) (1)
200
1.4
ASTM D1002
ELECTRICAL
Dielectric Breakdown Voltage (Vac) (2)
VALUE
6000
TEST METHOD
ASTM D149
Flame Rating
V-O
U.L.94
THERMAL
Bulk Thermal Conductivity of Resin (W/m-K)
0.7
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Lamination Pressure (psi)
25
75
TO-220 Thermal Performance (°C/W) (3)
3.5
2.8
1) Laminates at 75psi, cured at 160°C for 6 minutes. Lap Shear tested at 25°C.
2) The ASTM D149 test method was completed on cured Bond-Ply LMS 500P material. No pressure was applied to the product
during the cure cycle. Actual application dielectric performance will vary with primary dependence on consistent material handling of
Bond-Ply LMS 500P in the pre-cured or "green" state and applied pressure and dwell time during the lamination process.
3) TO-220 Thermal Performance testing, per The Bergquist RD2010 specification for Laminates, was completed on pre-laminated TO-
220 assemblies. Lamination was completed at the pressure levels referenced above. Actual pressure during performance testing
was limited to the inherent weight distribution of the TO-220 component. No additional pressure was applied.
TYPICAL APPLICATIONS INCLUDE
• Discrete semi-conductor packages bonded to heat spreader or heat sink
CONFIGURATIONS AVAILABLE
• Roll form
• Sheet form
• Die-cut parts
PDS_BP_LMS 500P_April 2012