923190 Datasheet, PDF (1/25 Pages) List of Unclassifed Manufacturers – CompactPCI Connectors acc. to PIGMG 2.0 Rev. 3.0

Catalog E 074486 08/00 Edition 1
CompactPCI Connectors acc. to PIGMG 2.0 Rev. 3.0
General
Late in 1999 PCI Industrial Computer Manufacturers Group
(PICMG) introduced the new revision 3.0 of the Compact-
PCI Core Specification. Version 3.0 of this specification
comprises a.o. hot swap and computer telephony specifi-
cations such as pin sequencing. For CompactPCI, the
metric ERmet connectors are specified in accordance with
IEC 61076-4-101 which are available in build types A, B,
AB, and as monoblock versions. This new version of the
CompactPCI specification has the consequence a.o. that
for 3 HE backplanes on position P2 a male connector, build
type B with long connection pins for AB transfer and AB
shrouds are inserted into position rP2. At the rear card end,
on position rJ2, a sheilded female connector in build type
AB is specified. For 6 HE backplanes, on P3 and P5, the
male connector - build type B with long connection pins -
for AB transfer and AB shrouds have to be inserted into
positions rP3 and rP5. At the rear card end, on positions
rJ3 and rJ5, a shielded female connector, build type AB,
has been specified here. On P4, a blade contact strip, build
type A with long connection pins for A shroud and A shroud
frames, has been specified on position rP4. For the rear
card end, a shielded female connector, build type A, has
been defined on rJ4. For male connectors with shrouds in
build types A and B, the specification only requires a series
a grounding for the upper screening panel.
All necessary connectors required in accordance with the
new CompactPCI specification are available from ERNI. In
addition, for CompactPCI applications, ERNI also offers an
economic solution for a male connector with long terminal
pins, which is populated with shield contacts on row a only.
In addition to the new AB compatible male connectors for
CompactPCI, ERNI also supplies shrouds. Here, all shrouds
are available in four different heights (3.9 mm, 4.5 mm, 5.3
mm, and 6.1 mm) in order to adapt to the printed circuit
board thickness of the backplanes.
http://Connect.ERNI.com/contact/
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