8200C Datasheet, PDF (1/3 Pages) List of Unclassifed Manufacturers – ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE

PILOT TECHNICAL DATASHEET
ABLEBOND^® 8200C
ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE
DESCRIPTION
ABLEBOND^® 8200C low bleed die attach adhesive is
designed for small and medium sized dies across a
variety of leadframes including PPF, Cu and Ag. This
electrically conductive adhesive offers improved JEDEC
performance on QFN type packages.
ABLEBOND 8200C adhesive is a new version of the
RP-751 series that provides improved MRT on silver
and pre-plated leadframe.
FEATURES
• HIgh electrical conductivity
• Excellent adhesion to silver and pre-plated leadframe
• Oven and snap curable
Typical Uncured Properties
Filler Type
Viscosity @ 25ºC
Thixotropic Index
Work Life @ 25ºC
Est. Storage Life @ -40ºC
Cure Process Data
Weight Loss on Cure
Recommended Cure Condition
Snap Cure Profile
Physiochemical Properties
- Post Cure
Ionics
Chloride
Sodium
Potassium
Weight Loss @ 300ºC
8200C
Test Description
Silver
11,500 cP
5.0
24 hours
1 year
Brookfield CP51 @ 5 rpm
Viscosity @ 0.5/Viscosity @ 5 rpm
25% increase in viscosity @ RT
8200C
Test Description
7%
10 x 10 mm Si die on glass slide
30 minutes ramp to 175ºC + 15 minutes @ 175ºC
Test
Method
ATM-0018
ATM-0089
ATM-0087
ATM-0068
Test
Method
ATM-0031
Zone Number 1 2 3 4 5 6 7 Time
Temp ºC 140 150 160 200 220 220 220 120 sec
N₂ Flow
10 liters/minute @ 150ºC
8200C
Test Description
Test
Method
< 10 ppm
< 10 ppm
< 10 ppm
Teflon flask 5 gm sample / 20-40
mesh 50 gm DI water 100ºC for
24 hours
ATM-0007
1%
Thermogravimetric Analysis
ATM-0073
Typical properties are not intended for use as specification limits. If you need to write a specification, ask for our
Standard Release Specification. This is a Pilot product that has been converted to high volume manufacturing and
is being monitored for process stability. During this monitoring period, certain properties may be adjusted slightly.
02/06
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