634-10ABP Datasheet, PDF (1/20 Pages) List of Unclassifed Manufacturers – BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES Surface Mount Heat Sinks
D²PAK, TO-220, SOT-223, SOL-20
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a
variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
• Copper with tin-lead plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
Standard
P/N
Height Above
PC Board
in. (mm)
217-36CT6 ̆
217-36CTT6
217-36CTR6̆
.390 (9.9)
.390 (9.9)
.390 (9.9)
Material: Copper, Tin, Lead Plated
MECHANICAL DIMENSIONS
Footprint
Dimensions
in. (mm)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
Package
Format
Bulk
Tube
Tape & Reel
217 HEAT SINK WITH
DDPAK DEVICE
Package
Quantity
1
20
250
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection)
55°C @ 1W
55°C @ 1W
55°C @ 1W
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
THERMAL PERFORMANCE
6 LAYER BOARD, D' PAK
125°C LEAD, 40°C AMBIENT
217-36CT6
Device Power Dissipation. W
KEY: í Device only, NC v Device + HS, NC ̆ Device + HS, 100 lfm „ Device + HS, 200 lfm ȣ Device + HS, 300 lfm
SECTION A-A
NOTES
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
TAPE DETAILS
REEL DETAILS
All other products, please contact factory for price, delivery, and minimums.
30
Dimensions: in.
̆ Normally stocked