2RFANT3216120A5T Datasheet, PDF (1/1 Pages) List of Unclassifed Manufacturers – Surface Mounted Devices with a small dimension of 3.2x 1.6 x 1.2 mm3 meet future miniaturization trend

Walsin Technology Corporation
LTCC Multi Layer Chip Antenna - For ISM Band 2.4GHz Application
ʳʳ
FEATURES
APPLICATIONS
Surface Mounted Devices with a small dimension of 3.2
x 1.6 x 1.2 mm³ meet future miniaturization trend
High stability in Temperature / Humidity Change
Embedded and LTCC (Low Temperature Co-fired
Bluetooth related includes earphone, SDIO interface
Wireless LAN 802.11b/g, Dongle, USB interface,
Compact Flash Card.
ISM band 2.4GHz applications.
Ceramic) technology is able to future integrate with
system design as well as beautifying the housing of final
CONSTRUCTION
product.
Test Board
ELECTRICAL CHARACTERISTICS *^Note-1
Item
Working Frequency Range
Peak Gain
Specification
2.4 GHz Д 2.5GHz
2 dBi (typical)
VSWR
2 max.
Polarization
Linear
Azimuth Bandwidth
Omni-directional
Impedance
50Ω
* Note: Specification definition based on test board design as
below
DIMENSION
Ω
Ω
Insertion Loss (S11)
a
a
W
1. 2.40GHz
2. 2.45GHz
3. 2.50GHz
-12.124 dB
-16.572 dB
-13.960 dB
L
T
Symbol
L
W
T
a
Dimension
3.20 ± 0.20 mm
1.60 ± 0.10 mm
1.20 ± 0.10 mm
0.25 ± 0.15 mm
Introduction of RFANT3216120A5T
CONTACT INFORMATION
For more information, please contact with
Walsin Technology Corporation.
Tel
: 886-3-475-8711
Fax
: 886-3-475-5197
E mail : [e-mail]
Web Site
: http://www.passivecomponent.com
Specification subject to change without prior notice.
Aug. 2006