2815A Datasheet, PDF (1/3 Pages) List of Unclassifed Manufacturers – THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE

DEVELOPMENTAL TECHNICAL DATASHEET
ABLEBOND^® 2815A
THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE
DESCRIPTION
ABLEBOND^® 2815A die attach adhesive offers high
thermal conductivity to minimize thermal resistance
between the chip and substrate. This adhesive is
designed to provide improved workability for applica-
tions requiring high heat extraction from die.
FEATURES
• Excellent thermal and electrical conductivity
• Good dispensability and good fillet formation
• Good performance on Ag/Cu leadframes
• Low moisture absorption
Typical Uncured Properties
Filler Type
Viscosity @ 25ºC
Thixotropic Index
Work Life @ 25ºC
Est Storage Life @ -40ºC
Cure Process Data
Weight Loss on Cure
Recommended Cure Condition
PHYSIOCHEMICAL PROPERTIES
- Post Cure
Ionics
Chloride
Sodium
Potassium
Water Extract Conductivity
pH
Glass Transition Temperature
Coefficient of Thermal Expansion
Below Tg
Above Tg
ABLEBOND 2815A
Test Description
Silver
8000 cP
5.6
24 hours
1 year
Brookfield CP51 @ 5 rpm
Viscosity @ 0.5/Viscosity @ 5 rpm
25% increase in viscosity @ RT
ABLEBOND 2815A
Test Description
6.8%
10 x 10 mm Si die on glass slide
30 min ramp RT to 200ºC + 30 min @ 200ºC in N₂ oven
ABLEBOND 2815A
Test Description
< 10 ppm
< 10 ppm
< 10 ppm
70 µmhos/cm
3.5
63ºC
Teflon flask, 5 gm sample/20-40
mesh, 50 gm DI water, 100ºC for
24 hours
Conductometer
pH meter
TMA penetration mode
Test
Method
ATM-0018
ATM-0089
ATM-0087
ATM-0068
Test
Method
ATM-0031
Test
Method
ATM-0007
ATM-0044
ATM-0002
ATM-0058
64 ppm/ºC
122 ppm/ºC
TMA expansion mode
ATM-0055
Typical properties are not intended for use as specification limits. If you need to write a specification, ask for our Standard Release Specification.
This is a developmental product that has been converted to high volume manufacturing and is being monitored for process stability. During this
monitoring period, certain properties may be adjusted slightly.
09/03
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