23-6337-8806 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – No-Clean Cored Wire

®
245
No-Clean Cored Wire
Product Description
Kester 245 No-clean Cored Wire was developed
to complement low residue liquid fluxes being used
by the electronics industry. The chemistry is
based on some of the same principles that have
been safely used for years in mildly activated rosin
fluxes. The use of 245 No-clean Cored Wire
results in visually acceptable assemblies without
cleaning, yet soldering quality and efficiency is
comparable to that obtained with mildly activated
rosin flux. Kester 245 was formerly classified as
Type LR per MIL-F-14256. Kester 245 is Bellcore
GR-78 compliant.
Performance Characteristics:
• Highly reliable post-soldering residue
• Minimal residue
• Compatible with leaded and lead-free alloys
• Classified as ROL0 per J-STD-004
• Compliant to Bellcore GR-78
RoHS Compliance
This product meets the requirements of the RoHS
(Restriction of Hazardous Substances) Directive,
2002/95/EC Article 4 for the stated banned
substances. (Applies only if this core flux is
combined with a lead free alloy)
Reliability Properties
Copper Mirror Corrosion: Low
Tested to J-STD-004, IPC-TM-650, Method 2.3.32
Corrosion Test: Low
Tested to J-STD-004, IPC-TM-650, Method 2.6.15
Silver Chromate: Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.33
Chloride and Bromides: None Detected
Tested to J-STD-004, IPC-TM-650, Method 2.3.35
Fluorides by Spot Test: Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1
SIR, IPC (typical): Pass
Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3
Blank
245
Day 1
Day 4
Day 7
1.2 ×10¹⁰ Ω
9.4 × 10⁹ Ω
8.6 ×10⁹ Ω
1.7 × 10⁹ Ω
1.9 × 10⁹ Ω
2.1 × 10⁹ Ω
Spread Test (typical):
Tested to J-STD-004, IPC-TM-650, Method 2.4.46
Flux Core Solder
Plastic Rosin Core
285 Mildly Activated Rosin
245 No-Clean
Area of Spread mm² (in²)
Sn63Pb37
194 (0.30)
335 (0.52)
348 (0.54)