22460 Datasheet, PDF (1/3 Pages) List of Unclassifed Manufacturers – Lead-Free No Clean Solder Paste

NC258
SAC305
Lead-Free No Clean Solder Paste
Features:
- Long Pause-to-Print Capabilities
- Excellent Wetting, Even Leadless Devices
- Enhances Fine Print Definitions
- Reduced Voiding
- No Head-in-Pillow
- RoHS Compliant
Description:
NC258 has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces
such defects as voiding and eliminates head-in-pillow. The superior wetting ability of NC258 results in bright, smooth and
shiny solder joints. It also offers very low post process residues, which remain crystal clear even at the elevated
temperatures required for today’s lead-free alloys.
Printing:
- Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16
mm (½ to ⅝ inch) is normally sufficient to begin).
- Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and
workable properties.
- NC258 provides the necessary tack time and force for today’s high speed placement equipment, which will enhance
product performance and reliability.
- Cleaning of your stencil will vary by application; however, it can be accomplished using AIM DJAW-10 stencil
cleaner.
RECOMMENDED INITIAL PRINTER SETTINGS BELOW ARE DEPENDENT ON PCB AND PAD DESIGN
PARAMETER RECOMMENDED INITIAL SETTINGS
PARAMETER
RECOMMENDED INITIAL SETTINGS
Squeegee Pressure 0.9 - 1.5 lbs/inch of blade
PCB Separation Distance 0.75-2.0 mm (.030-.080”)
Squeegee Speed 0.5 - 6 inches/second
PCB Separation Speed ^{0.5 - 2 mm/second}
Snap-off Distance On Contact 0.00 mm (0.00”)
Reflow Profile:
Two unique profile families are depicted below; both can be used in ramp-spike or ramp-soak-spike applications,
and they each have similar reflow temperatures. The two profiles differ in where they reach their respective peak
temperatures, as well as the time above liquidus (TAL). The shorter profile of the two would apply to smaller
assemblies, where as the longer profile would apply to larger assemblies, such as backplanes or high-density
boards. The shaded area defines the process window. Oven efficiency, board size/mass, component type and
density all influence the final profile for a given assembly. These profiles are starting points, and processing
boards with thermal-couples attached is recommended to optimize the process.