120-2 Datasheet, PDF (1/5 Pages) List of Unclassifed Manufacturers – THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS

WTS001_p50-68 6/14/07 10:46 AM Page 64
Accessory
Products
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
120 SERIES
The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with
a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of
only 0.05°C/W for a 0.001 in. film with an area of one square inch. There is no measurable increase in case tem-
perature of a mounted semiconductor on a heat sink after the 6-month stabilization period (Time versus Thermal
Resistivity graph below).
TYPICAL VALUES FOR THERMAL RESISTANCE,
CASE TO SINK (Ø_cs) WHEN THERMAL JOINT
COMPOUNDS ARE USED
Typical
Mounting Torque Thermal
in inch • pounds Resistance
Case Style Characteristics
(N•M)
(°C/W)
T0-3
8 (0.9)
0.09
TO-66
9 (0.9)
0.14
TO-220
8 (0.9)
0.50
0.19 (4.8) stud x 0.44 (11.2) hex
15 (1.7)
0.16
0.25 (6.4) stud x 0.69 (17.5) hex
30 (3.39)
0.10
0.38 (9.7) stud x 1.06 (26.9) hex
75 (8.47)
0.07
0.50 (12.7) stud x 1.06 (26.9) hex 125 (14.12)
0.75 (19.1) stud x 1.25 (31.8) hex 600 (67.79)
0.07
0.052
120 SERIES - THERMAL JOINT COMPOUND
Characteristic
Description
Volume Resistivity
5 X 10¹⁴ ohm-cm
Dielectric Strength
225 volts/mil
Specific Gravity
Thermal Conductivity @ 36°C
2.1 min.
0.735 W/(m)(K)
5.1(Btu) (in.)/(hr)(ft²)(°F)
Thermal Resistivity (P)
56 (°C)(in.)/watt
Bleed, % after 24 hrs @ 200°C
0.5
Evaporation, % after 24 hrs @ 200°C 0.5
Color
opaque white
Shelf life
5 years
Operating Temperature Range (°C)
-40/+200
120 SERIES - ORDER GUIDE
Series -
P/N
Container Size
120-SA
4 gram plastic pak
120-2
2 oz (0.06 kg) jar
120-5
5 oz (0.14 kg) tube
120-8
8 oz (0.23 kg) jar
120-80
5 lb (2.27 kg) can
120-320
20 lb (9.08 kg) can
HIGH PERFORMANCE THERMAL COMPOUND
122 SERIES
122 Series Thermal Joint Compound is a stable, silicone based, thixotropic paste developed to provide premium
performance at an affordable price. It is formulated to significantly reduce contact thermal resistance where
power densities are concentrated in devices such as flip chip, reduced die size, and ‘overclock’ microprocessors.
When applied as a thin film between a Wakefield heat sink and device it possesses superior thermal conductivity
compared to traditional ‘grease’. It is compatible with automated or manual dispensing methods and is fully RoHS
compliant.
122 SERIES THERMAL JOINT COMPOUND
Typical Characteristics
Description
Appearance
Thermal Conductivity
Smooth Gray paste
2.5 W / m °K,
17.3 (Btu) (in.)/(hr) (ft²) (⁰F)
Thermal Resistance
0.02 °C in 2 / W
Bleed
0.015 wt%, 24 hrs at 200°C
Evaporation
0.150 wt%, 24 hrs at 200°C
Volume Resistivity
1.4 x 10 ¹⁰ ohm-cm
Dielectric Strength
225 volts/mil
Specific Gravity
2.23 (gm/cc) at 25°C
Operating Range
-40°C to 205°C
Shelf Life
5 years
122 SERIES - ORDER GUIDE
Series -
P/N
Container Size
122-10CC
10cc syringe
122-2
2 oz (0.06 kg) jar
122-30CC
30cc syringe
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