FMM5709X Datasheet, PDF (6/9 Pages) List of Unclassifed Manufacturers – K/Ka Band Low Noise Amplifier MMIC

FMM5709X
K / Ka Band Low Noise Amplifier MMIC
■ Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters)
1440
RF-in
680
RF-out
870
140
0
0 140
670
VDD
1130
1470 1650
Chip Size : 1650±30μm x 1440±30μm
Chip Thickness : 　85μm±20μm
Bonding Pad Size :
RF-Pad : 　 80μm x 160μm
VDD-Pad : 80μm x 80μm
6