UT1553B Datasheet, PDF (48/52 Pages) List of Unclassifed Manufacturers – RTI Remote Terminal Interface

D
1.000 ± 0.025
A
0.100 MAX.
E
0.700 + 0.015
L
0.330
MIN.
b
0.016 + 0.002
e
0.050
PIN 1 I.D
(Geometry Optional)
TOP
c + 0.002
0.007 - 0.001
END
Q
0.070 + 0.010
(At Ceramic Body)
Notes:
1. All package finishes are per MIL-M-38510.
2. It is recommended that package ceramic be mounted to
a heat removal rail located on the printed circuit board.
A thermally conductive material such as MERECO XLN-589
or equivalent should be used.
3. Letter designations are for cross-reference to MIL-M-38510.
36-Lead Flatpack, Dual Cavity (50-MIL Lead Spacing)
Packaging-9