PLB010330 Datasheet, PDF (4/5 Pages) List of Unclassifed Manufacturers – MAGIC LED

PLB010330 Series | Advanced Product Information
Mechanical Specifications
Description
Chip Area
Chip Thickness
Diameter of top (Al) Bond Pads
Al Bond Pad Thickness
Back Contact Metal (Au) Area
Back Contact Metal Thickness
Dimensions
(µm)
1140 x 1140
150
100x100
2
1140 x 1140
0.5
Chip Outline Dimensions
Tolerance
(µm)
+/-10
± 10
± 10
± 0.2
+/-10
±0.05
Notes:
1. All dimensions are in mm (mils)
2. All dimensions are to a tolerance of ±0.25mm (0.01”) unless otherwise stated
Handling Instructions
Plessey LEDs are not designed to operate with reverse bias.
Precautions are required to prevent reverse bias in applications and during handling.
Datasheet 293065 Issue 1
Page 4 of 5
07/07/2014