HMC489LP5 Datasheet, PDF (4/6 Pages) List of Unclassifed Manufacturers – SURFACE MOUNT PHEMT 1 WATT POWER AMPLIFIER, 12 - 16 GHz

v01.0705
HMC489LP5 / 489LP5E
SURFACE MOUNT PHEMT 1 WATT
POWER AMPLIFIER, 12 - 16 GHz
Power Dissipation*
5
Typical Supply Current vs. Vdd
10.5
Max Pdiss @ +85C
10
Vdd (Vdc)
+6.5
Idd (mA)
1330
+7.0
1300
9.5
+7.5
1285
9
Note: Amplifier will operate over full voltage ranges shown
8.5
above. Vgg adjusted to achieve Idd= 1300 mA at +7.0V.
14 GHz
8
Absolute Maximum Ratings
7.5
Drain Bias Voltage (Vdd1, 2, 3, 4, 5) +8 Vdc
7
-10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 18 20 22 24
INPUT POWER (dBm)
* Refer to “Thermal Management for Surface Mount
Components” application note herein.
Gate Bias Voltage (Vgg)
-2.0 to 0 Vdc
RF Input Power (RFin)(Vdd = +7.0 Vdc) +28 dBm
Channel Temperature
150 °C
Continuous Pdiss (T= 85 °C)
(derate 154 mW/°C above 85 °C)
10 W
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Thermal Resistance
(channel to ground paddle)
Storage Temperature
Operating Temperature
6.5 °C/W
-65 to +150 °C
-40 to +85 °C
Outline Drawing
Package Information
Part Number
Package Body Material
HMC489LP5
Low Stress Injection Molded Plastic
HMC489LP5E RoHS-compliant Low Stress Injection Molded Plastic
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Lead Finish
Sn/Pb Solder
100% matte Sn
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
H489
XXXX
H489
XXXX
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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