E2001 Datasheet, PDF (4/4 Pages) List of Unclassifed Manufacturers – SURFACE MOUNT 10BASE-T INTERFACE MODULES

SURFACE MOUNT 10BASE-T
INTERFACE MODULES
Fully Integrated for Adapter, Hub, and
Motherboard Applications
Schematics
E2009, PE-68056
CHIP SIDE
1
TRANSMIT CHANNEL
LOW PASS
FILTER
UTP SIDE
8
CHIP SIDE
16
RECEIVE CHANNEL
LOW PASS ^1:1
FILTER
UTP SIDE
9
5
12
3
LOW PASS
FILTER
6
14
LOW PASS
FILTER
11
Turns Ratio for Transmit: PE-68056 is 1:1; E2009 is 1: 2.
NOTE: The PE-68056 is designed for use with most transceivers requiring a
turns ratio of 1:1 on transmit. The E2009 is designed for use with DEC and most
other transceivers requiring a turns ratio of 1: 2 on transmit.
Typical Application Circuit
E2009, PE-68056
TXN-
TX-
TXP+
TX+
ANALOG INTERFACE MODULE
1
3
5678
LPF
LPF
LPF
LPF
2 _TD-
1 _TD+
3 _RD+
UTP
6 _RD-
RJ-45
CONNECTOR
16
14 13 12 11 10 9
RXI+
100 Ω
RXI-
NOTE: Resistors are NOT included in module.
For More Information:
Application Notes
Each module in this application contains low pass filters,
isolation transformers, and common mode chokes. These
components provide impedance matching, equipment
isolation, and EMI suppression to comply with IEEE 802.3
requirements. The E2001, E2003, E2004, E2007, PE-68025,
and PE-68027 also provide the necessary data and
pre-emphasis resistors recommended by most transceiver
manufacturers.
User compliance with FCC/CSPR Class B requirements can
be achieved by applying rigorous design guidelines to
suppress noise mechanisms. Attention to high frequency
signal paths, proper PCB grounding techniques, and
component placement are critical. Pins 5 and 12, when
grounded, provide noise return paths. For PE-68025,
PE-68026, and PE-68027, one of these pins (typically pin 12)
must be decoupled with a bypass capacitor. The E2001,
E2003, E2004, E2007, E2009, and PE-68056 do not require
the bypass capacitor, and pins 5 and 12 may be connected
directed to ground.
Recommended module orientation with respect to the RJ-45
connector is illustrated in each application circuit. Output pins
6 through 11 should be routed with short, matched traces to
the connector for optimum EMI performance.
Surface mount devices manufactured by Pulse are designed
to meet all published specifications after exposure to surface
mount soldering temperatures. The products in this data
sheet are transfer molded in I.C. style packaging, making
them robust enough to withstand convection and infrared
reflow solder temperatures up to 235^oC. In addition,
compliant leads provide excellent solder-joint reliability with a
coplanarity of ±.002”(0.05 mm).
Modules are shipped in tubes unless Tape & Reel is
specified. Please add the suffix “T” (i.e. PE-68025T) for Tape
& Reel orders in increments of 350 pieces.
UNITED STATES
(Worldwide)
12220 World Trade Drive
San Diego, CA 92128
Quick-Facts: 619 674 9672
http://www.pulseeng.com
TEL: [phone]
FAX: [phone]
UNITED KINGDOM
(Northern Europe)
1 & 2 Huxley Road
The Surrey Research Park
Guildford, Surrey GU2 5RE
United Kingdom
TEL: [phone]
FAX: [phone]
FRANCE
(Southern Europe)
Zone Industrielle
F-39270
Orgelet
France
TEL: [phone]
FAX: [phone]
SINGAPORE
(Southern Asia)
150 Kampong Ampat
#07-01/02
KA Centre
Singapore 368324
TEL: [phone]
FAX:[phone]
TAIWAN, R.O.C.
(Northern Asia)
3F-4, No. 81, Sec. 1
HsinTai Wu Road
Hsi-Chih, Taipei Hsien
Taiwan, R.O.C.
Tel: [phone]
FAX: [phone]
DISTRIBUTOR
Performance warranty of products offered on this data sheet is limited to the parameters specified. Data is subject to change without notice. Other brand and product
names mentioned herein may be trademarks or registered trademarks of their respective owners.
Printed on recycled paper. ©1997, Pulse Engineering, Inc.
4
E115.A (9/97)